Search Results1-9 of  9

  • NAGATAKE Mami ID: 9000001380820

    Articles in CiNii:14

    • Eveluation of Warp of Printed Wiring Board under Reflow Soldering (1997)
    • 携帯電話開発へのシミュレーションの適用 (特集:インターネット時代の開発スピードを実現する設計シミュレーション) -- (製品への適用) (2000)
    • プリント基板の衝撃信頼性解析 (2005)
  • NAGATAKE Mami ID: 9000256072735

    Production Technology Div., Fujitsu Ltd. (1997 from CiNii)

    Articles in CiNii:1

    • Evaluation of Warp of Printed Wiring Board under Reflow Soldering. (1997)
  • NAGATAKE Mami ID: 9000256073325

    Manufacturing System Engineering Group, Fujitsu Ltd. (1999 from CiNii)

    Articles in CiNii:1

    • The Peeling Strength Evaluation of the BGA/CSP Solder Joints. (1999)
  • NAGATAKE Mami ID: 9000256073691

    Packaging Technology Development Div., Corporate Manufacturing Systems Engineering Group, FUJITSU Limited (2001 from CiNii)

    Articles in CiNii:1

    • Use of Numerical Simulations for Developing Portable Telephones (2001)
  • NAGATAKE Mami ID: 9000386208619

    Fujitsu Advanced Technologies Co, Ltd,. (2017 from CiNii)

    Articles in CiNii:1

    • A study on frequency response analysis method for HALT simulation (2017)
  • NAGATAKE Mami ID: 9000386208622

    FUJITSU Advanced Technologies Limited (2017 from CiNii)

    Articles in CiNii:1

    • Evaluating validity of HALT results by application of simulation technology (2017)
  • NAGATAKE Mami ID: 9000402075299

    FUJITSU Advanced Technologies Limited (2018 from CiNii)

    Articles in CiNii:1

    • Evaluation of solder joints by HALT stress (2018)
  • NAGATAKE Mami ID: 9000404513487

    Fujitsu Advanced Technologies Ltd. (2019 from CiNii)

    Articles in CiNii:1

    • Thermal Warp Simulation in Substrate with Properties Change of Curing Resin (2019)
  • nagatake mami ID: 9000283739299

    Fujitsu Limited (2004 from CiNii)

    Articles in CiNii:1

    • The evaluation of impact reliability for mobile equipments (2004)
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