Search Results1-20 of  107

  • Nawafune Hidemi ID: 9000007669267

    Articles in CiNii:1

    • Electrolytic Recovery of Metals from Sludges (1979)
  • NAWAFUNE Hidemi ID: 9000000641216

    Faculty of Science and Engineering, High Tech. Research Center, Konan University (2001 from CiNii)

    Articles in CiNii:1

    • Direct Electroless Silver Plating on Copper Metal from Succinimide Complex Bath Using Imidazole as the Reducing Agent (2001)
  • NAWAFUNE Hidemi ID: 9000001107677

    甲南大学 理工学部 機能分子化学科 (2003 from CiNii)

    Articles in CiNii:1

    • Development of fine material processing technique by 266nm UV Laser (2003)
  • NAWAFUNE Hidemi ID: 9000003016004

    Faculty of Science and High Technology Research Center, Konan University (2001 from CiNii)

    Articles in CiNii:2

    • Breakthrough in Copper Interconnection for LSI (2001)
    • Actualities and Problems of Lead-Free Solder Plating (2001)
  • NAWAFUNE Hidemi ID: 9000014186603

    Department of Nanobiochemistry, Frontiers of Innovative Research in Science and Technology (FIRST), Konan University (2011 from CiNii)

    Articles in CiNii:4

    • Fabrication of Conductive Thin Films on Precursor Polyimide via Chemical Reduction of Nickel (II) Complex (2008)
    • Site-Selective Direct Nickel Metallization on Precursor Polyimide Using Microcontact Printing (2009)
    • In Situ Generation of Silver Nanoparticles in Ion-exchangeable Polymer Photonic Crystals (2011)
  • NAWAFUNE Hidemi ID: 9000019083181

    Frontiers of Innovative Research in Science and Technology(FIRST), Konan University (2011 from CiNii)

    Articles in CiNii:3

    • Electrodeposition of CuSn Alloy from Sulfosuccinate Bath (2004)
    • For this 60^<th> Anniversary of the Founding During this Severe Once-in-a-century Scale Depression (2010)
    • Electrodeposition of Cu-Sn Alloy from an Environmentally Friendly Noncyanide Sulfosuccinate Bath (2011)
  • NAWAFUNE Hidemi ID: 9000021201581

    Fac. of Sci., Konan Univ. (1994 from CiNii)

    Articles in CiNii:1

    • Surface Treatment of Printed Wiring Boards for Surface Mounting and Interconnection. (1994)
  • NAWAFUNE Hidemi ID: 9000021202005

    Fac. of Sci., Konan Univ. (1993 from CiNii)

    Articles in CiNii:1

    • Mass Balance and Deposition Mechanism in Electroless Pd-P Alloy Plating from a Ethylenediamine Complex Bath Using Hypophosphite as a Reducing Agent. (1993)
  • NAWAFUNE Hidemi ID: 9000021203898

    Fac. of Sci., Konan Univ. (1990 from CiNii)

    Articles in CiNii:1

    • Bright tin plating from gluconate baths. (1990)
  • NAWAFUNE Hidemi ID: 9000021203916

    Fac. of Sci., Konan Univ. (1990 from CiNii)

    Articles in CiNii:1

    • Thermal expansion of chemically deposited copper films. (1990)
  • NAWAFUNE Hidemi ID: 9000021224492

    Fac. of Sci., Konan Univ. (1994 from CiNii)

    Articles in CiNii:1

    • Crystal Structure and Properties of Electrodeposited Palladium-Nickel-Phosphorus Alloy. (1994)
  • NAWAFUNE Hidemi ID: 9000021251579

    Fac. of Sci., Konan Univ. (1994 from CiNii)

    Articles in CiNii:1

    • Monitoring of the Composition of Electroless Palladium-Phosphorus Alloy Plating Baths by FTIR ATR Spectrometry. (1994)
  • NAWAFUNE Hidemi ID: 9000021252320

    Fac. of Sci., Konan Univ. (1993 from CiNii)

    Articles in CiNii:1

    • Room Temperature Softening of Copper Film Electrodeposited from Ethylenediamine Complex Bath. (1993)
  • NAWAFUNE Hidemi ID: 9000021254020

    Fac of Sci, Konan Univ (1991 from CiNii)

    Articles in CiNii:1

    • Solderability and contact resistance of chemically deposited Pd-P alloys. (1991)
  • NAWAFUNE Hidemi ID: 9000021254361

    Fac. of Sci., Konan Univ. (1990 from CiNii)

    Articles in CiNii:1

    • Chemical equilibria in electroless copper plating bath. (1990)
  • NAWAFUNE Hidemi ID: 9000021279898

    Fac. of Sci., Konan Univ. (1993 from CiNii)

    Articles in CiNii:1

    • Effect of Phosphorus Codeposition on Properties of Electrodeposited Palladium-Nickel-Phosphorus Alloy. (1993)
  • NAWAFUNE Hidemi ID: 9000021280718

    Fac. of Sci., Konan Univ. (1992 from CiNii)

    Articles in CiNii:1

    • Electrodeposition of Copper from Ethylenediamine Complex Solution and Properties of Deposit. (1992)
  • NAWAFUNE Hidemi ID: 9000021309029

    Fac. of Sci., Konan Univ. (1994 from CiNii)

    Articles in CiNii:1

    • Polarization Characteristics in Electroless Palladium-Phosphorus Alloy Plating Baths. (1994)
  • NAWAFUNE Hidemi ID: 9000021311732

    Fac. of Sci., Konan Univ. (1991 from CiNii)

    Articles in CiNii:1

    • Electroless Pd-P Alloy Plating Using Phosphite as a Reducing Agent and Mechanism of its Autocatalytic Reduction. (1991)
  • NAWAFUNE Hidemi ID: 9000021312087

    Fac. of Sci., Konan Univ. (1990 from CiNii)

    Articles in CiNii:1

    • Mechanism of electroless copper plating from EDTA-complex bath. (1990)
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