Search Results1-20 of  21

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  • Negishi Nobuyuki ID: 9000008235002

    Articles in CiNii:1

    • A Preliminary Experiment on Quasi-Steady,High-Pressure Arc Discharge (1978)
  • Negishi Nobuyuki ID: 9000008235012

    Articles in CiNii:1

    • Thermionic Emissions from Tungsten,Rhenium and Molybdenum in Atmospheric Pressure Gases (1977)
  • Negishi Nobuyuki ID: 9000024962404

    Articles in CiNii:1

    • Effects of mask and necking deformation on bowing and twisting in high-aspect-ratio contact hole etching (Special issue: Recent advances in dry process and related technologies) (2009)
  • NEGISHI Nobuyuki ID: 9000006401572

    日立製作所中央研究所 (2007 from CiNii)

    Articles in CiNii:2

    • Investigation of Etching Mechanism in Fluorocarbon Plasma (2007)
    • Investigation of etching mechanism in fluorocarbon plasma (2007)
  • NEGISHI Nobuyuki ID: 9000021137714

    Articles in CiNii:1

    • Probe Measurement in a High-density lonized Gas (1980)
  • Negishi Nobuyuki ID: 9000003739216

    東京都立航空工業高等専門学校 (1979 from CiNii)

    Articles in CiNii:1

    • Probe Measurement in a High-Density Ionized Gas (1979)
  • Negishi Nobuyuki ID: 9000025065536

    Articles in CiNii:1

    • Investigation of bowing reduction in SiO2 etching taking into account radical sticking in a hole (2007)
  • Negishi Nobuyuki ID: 9000256218286

    Articles in CiNii:1

    • Probe Measurement in a High-Density Ionized Gas (1979)
  • Negishi Nobuyuki ID: 9000258653690

    Hitachi, Ltd., Central Research Laboratory (2010 from CiNii)

    Articles in CiNii:1

    • Improvement of High Aspect Ratio Contact Etching Performance by using Real-Time Wafer Temperature Control (2010)
  • Negishi Nobuyuki ID: 9000401781972

    Articles in CiNii:1

    • Effects of Mask and Necking Deformation on Bowing and Twisting in High-Aspect-Ratio Contact Hole Etching (2009)
  • Negishi Nobuyuki ID: 9000401807995

    Articles in CiNii:1

    • Decrease in Ozone Density of Atmospheric Surface-Discharge Plasma Source (2012)
  • Negishi Nobuyuki ID: 9000402008855

    Articles in CiNii:1

    • Decrease in Ozone Density of Atmospheric Surface-Discharge Plasma Source (2012)
  • Negishi Nobuyuki ID: 9000402014782

    Articles in CiNii:1

    • Negative Impact of Etched Si Area on Selectivity and Positive Impact of Photoelectric Current on Etched Profile in Gate Etching with Different Wafer Bias Frequencies (2013)
  • Negishi Nobuyuki ID: 9000402016294

    Articles in CiNii:1

    • Silicon Mold Etching with Hard Mask Stack Using Spherical Structure of Block Copolymer for Bit-Patterned Media with 2.8 Tbit/in.2 (2013)
  • Negishi Nobuyuki ID: 9000402021115

    Articles in CiNii:1

    • Line-edge roughness increase due to wiggling enhanced by initial pattern waviness (2014)
  • Negishi Nobuyuki ID: 9000402043210

    Articles in CiNii:1

    • Atomic layer etching of silicon nitride using cyclic process with hydrofluorocarbon chemistry (2017)
  • Negishi Nobuyuki ID: 9000402051990

    Articles in CiNii:1

    • Mechanism of asymmetric etched profiles in trimming process (2018)
  • Negishi Nobuyuki ID: 9000402797447

    Articles in CiNii:1

    • Progress and perspectives in dry processes for nanoscale feature fabrication: fine pattern transfer and high-aspect-ratio feature formation (2019)
  • Negishi Nobuyuki ID: 9000402797467

    Articles in CiNii:1

    • Progress and perspectives in dry processes for emerging multidisciplinary applications: how can we improve our use of dry processes? (2019)
  • Negishi Nobuyuki ID: 9000402797487

    Articles in CiNii:1

    • Progress and perspectives in dry processes for leading-edge manufacturing of devices: toward intelligent processes and virtual product development (2019)
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