Search Results1-20 of  24

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  • Ryosuke Saeki/Koutarou Oowada/Junichi Yoshino ID: 9000237771893

    サレジオ工業高等専門学校 (2013 from CiNii)

    Articles in CiNii:1

    • A study on Active RFID tag energized by thermomodules (2013)
  • SAEKI Junichi ID: 9000002385431

    NUMAZU COLLEGE OF TECHNOLOGY (1985 from CiNii)

    Articles in CiNii:16

    • 沼津高専電子計算機室の管理運営について-2- (1978)
    • 対話形式による微分方程式の解の表示システム (1978)
    • 補助記憶装置を用いた大規模連立方程式の解法 (1978)
  • SAEKI Junichi ID: 9000003742385

    (株)日立製作所生産技術研究所生産システム第二研究部 (2008 from CiNii)

    Articles in CiNii:25

    • 大会講演・討論を聞いて (1997)
    • 10年間の技術の進歩 半導体封止 (1999)
    • A Practical Method for Predicting Gold-Wire Deformation in Transfer Molding Process of Semiconductor Devices Part I : Analysis of a BGA Package having Gold Wires with Uniform Dimensions (2000)
  • SAEKI Junichi ID: 9000003792524

    Tokyo University of Agriculture and Technology (2001 from CiNii)

    Articles in CiNii:3

    • SrCeO3系プロトン伝導体結晶の育成とその結晶構造 (1991)
    • 720 Vibration Control for High-Speed Elevator using Active Mass Damper (2001)
    • 3306 Vibration Control for High-Speed Elevator using Active Mass Damper (2001)
  • SAEKI Junichi ID: 9000016376055

    Bethel Co., Ltd. (2008 from CiNii)

    Articles in CiNii:1

    • Thermal Conductivity Measurement of Si/(Ge+Au) Artificial Superlattice Thin Film (2008)
  • SAEKI Junichi ID: 9000018680483

    TERRABYTE Co., Ltd. (2010 from CiNii)

    Articles in CiNii:1

    • 1711 Three dimensional analysis of CAE of thermosetting compounds (2010)
  • SAEKI Junichi ID: 9000253665904

    Production Engineering Research Laboratory, Hitachi, Ltd. (1993 from CiNii)

    Articles in CiNii:1

    • Flow Characteristics of Epoxy Compounds for Encapsulation of Semiconductor Devices (1993)
  • SAEKI Junichi ID: 9000254398298

    Production Engineering Research Laboratory, Hitachi Ltd. (1988 from CiNii)

    Articles in CiNii:1

    • Flow and heat transfer of an epoxy molding compound for low pressure transfer molding in channels. (1988)
  • SAEKI Junichi ID: 9000254931630

    Production Engineering Research Laboratory, Hitachi, Ltd. (1986 from CiNii)

    Articles in CiNii:1

    • Flow characteristics of epoxy resin systems for low pressure transfer molding. (1986)
  • SAEKI Junichi ID: 9000254932215

    Production Engineering Research Laboratory, Hitachi Ltd. (1988 from CiNii)

    Articles in CiNii:1

    • Viscosity change of an epoxy compound for low pressure transfer molding by means of rheological data analyzing system. (1988)
  • SAEKI Junichi ID: 9000256228320

    Articles in CiNii:1

    • Flow analysis of an epoxy compound for low pressure transfer molding in a circular cross-sectional channel. (1989)
  • SAEKI Junichi ID: 9000256229394

    Articles in CiNii:1

    • Flow channel design of a multi-cavity mold by filling simulation for thermosets. (1990)
  • SAEKI Junichi ID: 9000391697330

    Articles in CiNii:1

    • Flow Analysis of an Epoxy Compound for Low-Pressure Transfer Molding in a Circular Cross-Sectional Channel (1990)
  • Saeki Junichi ID: 9000024939696

    Articles in CiNii:1

    • Structural effects on thermal conductivity of SiGeAu superlattice thin films (2010)
  • Saeki Junichi ID: 9000252918900

    Production Engineering Research Laboratory, Hitachi, Ltd. (2000 from CiNii)

    Articles in CiNii:1

    • A Practical Method for Predicting Gold-Wire Deformation in Transfer Molding Process of Semiconductor Devices. Part I: Analysis of a BGA Package having Gold Wires with Uniform Dimensions.:Part I: Analysis of a BGA Package having Gold Wires with Uniform Dimensions (2000)
  • Saeki Junichi ID: 9000252918916

    Production Engineering Research Laboratory, Hitachi, Ltd. (2000 from CiNii)

    Articles in CiNii:1

    • A Practical Method for Predicting Gold-Wire Deformation in Transfer Molding Process of Semiconductor Devices (2000)
  • Saeki Junichi ID: 9000253664965

    Production Engineering Research Laboratory, Hitachi, Ltd. (2001 from CiNii)

    Articles in CiNii:1

    • A Practical Method for Predicting Gold-Wire Deformation in Transfer Molding Process of Semiconductor Devices (2001)
  • Saeki Junichi ID: 9000253664997

    Production Engineering Research Laboratory, Hitachi, Ltd. (2001 from CiNii)

    Articles in CiNii:1

    • Analysis of Heat Generation of Epoxy Compounds for Encapsulation of Semiconductor Devices (2001)
  • Saeki Junichi ID: 9000253665008

    Production Engineering Research Laboratory, Hitachi, Ltd. (2001 from CiNii)

    Articles in CiNii:1

    • Analysis of Heat Generation of Epoxy Compounds for Encapsulation of Semiconductor Devices (2001)
  • Saeki Junichi ID: 9000253665191

    Production Engineering Research Laboratory, Hitachi, Ltd. (2002 from CiNii)

    Articles in CiNii:1

    • Analysis of Polyurethane Foaming Flow:Part 1: Application of Foaming Density Formula to 3-D Flow Analysis (2002)
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