Search Results1-3 of  3

  • SATO Yoshizumi ID: 9000002846724

    Printed Circuit Board & Module Engineering Dept., Printed Circuit Board & Module Division, Toshiba Corporation Semiconductor Company (1999 from CiNii)

    Articles in CiNii:2

    • バンプ接続技術を用いたプリント配線板の微細化 (MES'97(第7回マイクロエレクトロニクスシンポジウム論文集)) (1997)
    • Buried Bump Interconnection Technology Printed Circuit Board (1999)
  • SATO Yoshizumi ID: 9000014272754

    Natural Science Corporation (2008 from CiNii)

    Articles in CiNii:1

    • Infants' Skin and Skin Care (2008)
  • SATO Yoshizumi ID: 9000256073382

    Printed Circuit Board & Module Engineering Dept., Printed Circuit Board & Module Division, Toshiba Corporation Semiconductor Company (1999 from CiNii)

    Articles in CiNii:1

    • Present and Future of Build-up PWB's-Their Possibility and Limitation. Buried Bump Interconnection Technology Printed Circuit Board. (1999)
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