Search Results1-19 of  19

  • SAYAMA Toshihiko ID: 9000002843633

    富山県工業技術センター (2015 from CiNii)

    Articles in CiNii:42

    • Observation of Microstructure Evolution in Sn-Pb Solder Micro-joints by Synchrotron Radiation X-ray Micro-tomography (2007)
    • Sn/Pb共晶はんだ接合部における相成長モデルと熱サイクル負荷への適用 (MES'99 第9回マイクロエレクトロニクスシンポジウム論文集) -- (シミュレーション・評価(2)) (1999)
    • Sn-3.0Ag-0.5Cuはんだ接合部における相成長による熱疲労き裂発生評価 (2002)
  • SAYAMA Toshihiko ID: 9000003800645

    Toyama Industrial Technology Center (2003 from CiNii)

    Articles in CiNii:1

    • Development of Electronic Components and Devices in Toyama Industrial Technology Center (2003)
  • SAYAMA Toshihiko ID: 9000256073653

    Machinery & Electronics Research Institute, Toyama Industrial Technology Center (2001 from CiNii)

    Articles in CiNii:1

    • Phase Growth Model and Application to Thermal Cyclic Loading in Sn/Pb Eutectic Solder Joints. (2001)
  • SAYAMA Toshihiko ID: 9000256074383

    Machinery & Electronics Research Institute, Toyama Industrial Technology Center (2004 from CiNii)

    Articles in CiNii:1

    • Evaluation of Thermal Fatigue Crack Initiation in Sn-3.0Ag-0.5Cu Solder Joints by Phase Growth Approach (2004)
  • SAYAMA Toshihiko ID: 9000329432947

    富山県工業技術センター機械電子研究所 (2016 from CiNii)

    Articles in CiNii:1

    • 619 Reduction of Radiated Sound from Opening Part of Toilet Bowl Using Active Noise Control (2016)
  • SAYAMA Toshihiko ID: 9000389436883

    Toyama Industrial Technology Center (2017 from CiNii)

    Articles in CiNii:1

    • Effect of joint thickness on fatigue strength properties of solder joints by using a high-rigidity lap joint specimen (2017)
  • SAYAMA Toshihiko ID: 9000389436890

    Toyama Industrial Technology Center (2017 from CiNii)

    Articles in CiNii:1

    • Nondestructive Strain Measurement of Solder Joints by Using Synchrotron Radiation X-ray CT (2017)
  • SAYAMA Toshihiko ID: 9000389436922

    Toyama Industrial technology Center (2017 from CiNii)

    Articles in CiNii:1

    • Nondestructive Observation of Die-attached Joints on Electronic Substrates with Cyclic Energization by Synchrotron Radiation X-ray Laminography (2017)
  • SAYAMA Toshihiko ID: 9000392291872

    富山県工業技術センター 機械電子研究所 (2017 from CiNii)

    Articles in CiNii:1

    • Simple Friction Damper Made by 3D Printing (2017)
  • Sayama Toshihiko ID: 9000258390952

    Toyama Industrial Technology Center (2006 from CiNii)

    Articles in CiNii:1

    • Evaluation of Thermal Fatigue Damage in Flip Chip Structure by Synchrotron Radiation X-ray Micro-tomography (2006)
  • Sayama Toshihiko ID: 9000258391677

    Toyama Industrial Technology Center (2003 from CiNii)

    Articles in CiNii:1

    • Evaluation of thermal fatigue and phase growth in Sn-3.0Ag-0.5Cu solder joints of surface mounted chip carriers (2003)
  • Sayama Toshihiko ID: 9000258392380

    Toyama Industrial Technology Center (2008 from CiNii)

    Articles in CiNii:1

    • Three-dimensional Observation of Thermal Fatigue Crack in Flip Chip Interconnects by Synchrotron Radiation X-ray Micro-tomography (2008)
  • Sayama Toshihiko ID: 9000283739267

    Toyama Industrial Technology Center (2004 from CiNii)

    Articles in CiNii:1

    • Evaluation of Thermal Fatigue Crack Initiation Lifetime in Solder Joints by Phase Growth Observation (2004)
  • Sayama Toshihiko ID: 9000283739274

    Toyama Prefectural University (2004 from CiNii)

    Articles in CiNii:1

    • Thermal Fatigue Evaluation by B-Sn Phase Growth Observation in Sn-3.0Ag-0.5Cu Solder Joints Bonded on Electroless Ni-P/Au Plating (2004)
  • Sayama Toshihiko ID: 9000347144325

    Toyama Industrial Technology Center (2011 from CiNii)

    Articles in CiNii:1

    • Experimental Evaluation of Thermal Fatigue Crack Propagation Process in Solder Joints of Chip Resistors by Synchrotron Radiation X-ray Micro-tomography (2011)
  • Sayama Toshihiko ID: 9000347144740

    Toyama Industrial Technology Center (2012 from CiNii)

    Articles in CiNii:1

    • Nondestructive Observation of Thermal Fatigue Cracks in PCB's Solder Joints by Synchrotron Radiation X-Ray Laminography (2012)
  • Sayama Toshihiko ID: 9000347144749

    Toyama industrial Technology Center (2012 from CiNii)

    Articles in CiNii:1

    • Three-dimensional and nondestructive evaluation of thermal fatigue crack propagation process in solder joints of different-sized resistor (2012)
  • Sayama Toshihiko ID: 9000397687575

    Toyama Industrial Technology Center (2013 from CiNii)

    Articles in CiNii:1

    • Feasibility Study of Fatigue Crack Propagation Monitoring in Flip-Chip Solder Joints by Synchrotron Radiation X-Ray Laminography (2013)
  • Sayama Toshihiko ID: 9000397687697

    Toyama Industrial Technology Center (2014 from CiNii)

    Articles in CiNii:1

    • Evaluation of Thermal Fatigue Crack Propagation Process in FBGA Solder Joints by Synchrotron Radiation X-Ray Laminography (2014)
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