Search Results1-20 of  165

  • Sekine Makoto ID: 9000018880579

    Articles in CiNii:1

    • Control of Super Hydrophobic and Super Hydrophilic Surfaces of Carbon Nanowalls Using Atmospheric Pressure Plasma Treatments (Special Issue : Advanced Plasma Science and Its Applications for Nitrides and Nanomaterials) (2012)
  • Sekine Makoto ID: 9000024954308

    Articles in CiNii:1

    • Highly Selective Etching of SiO₂ over Si₃N₄ and Si in Capacitively Coupled Plasma Employing C₅HF₇ Gas (2013)
  • Sekine Makoto ID: 9000237723614

    Articles in CiNii:2

    • Quantum Chemical Investigation for Chemical Dry Etching of SiO₂ by Flowing NF₃ into H₂ Downflow Plasma (2012)
    • Quantum Chemical Investigation of Si Chemical Dry Etching by Flowing NF₃ into N₂ Downflow Plasma (2012)
  • Sekine Makoto ID: 9000241525177

    Articles in CiNii:1

    • Dissociations of C₅F₈ and C₅HF₇ in Etching Plasma (Special Issue : Dry Process) (2013)
  • SEKINE Makoto ID: 9000000768409

    UConn (2006 from CiNii)

    Articles in CiNii:5

    • プラズマプロセス・装置はどこまで制御できるか? (2002)
    • Approach to systematic research methodology for plasma etchilng and their future prospects : Activity of ASET Plasma Labs. and technology prospects (2001)
    • 地球温暖化PFCガス対策の進捗と展望 : CVDクリーニングRITE Pj成果展開と産学官連携による実用化の展望 (2003)
  • SEKINE Makoto ID: 9000001085631

    ULSI Device Development Division, NEC Corporation (2003 from CiNii)

    Articles in CiNii:1

    • Dual Damascene Interconnect Technology for 130-nm-node Complementary Metal-Oxide-Semiconductor Devices Using Ladder-Oxide Film (2003)
  • SEKINE Makoto ID: 9000003188930

    Laboratory of Silviculture, Faculty of Agriculture, Hokkaido University (1978 from CiNii)

    Articles in CiNii:1

    • STUDIES ON THE PICEA GLEHNII FOREST : (V) SPECIES COMPOSITION AND REGENERATION OF THE SOUTHERNMOST NATURAL COMMUNITY OF THE Picea glehnii ON MT. HAYACHINE. (1978)
  • SEKINE Makoto ID: 9000004964871

    Articles in CiNii:14

    • Recent Advances in Dry Etching Technology (2002)
    • Measurement of Electron Energy Distribution Function by RF-Biased Optical Probe Method (1998)
    • Plasma and process technologies (2010)
  • SEKINE Makoto ID: 9000004966813

    Association of Super-advanced Electronics Technologies (1999 from CiNii)

    Articles in CiNii:4

    • Plasma etching technology (1995)
    • SiO_2 Selective Etch Mechanism in High-Aspect-Ratio holes (1996)
    • Characterization of Highly Selective SiO_2/Si_3N_4 etching of High-Aspect-Ratio Holes (1995)
  • SEKINE Makoto ID: 9000004972632

    NEC Electronics Corporation (2008 from CiNii)

    Articles in CiNii:4

    • Degradation Mechanism of Contact Resistance During Window Formation (1995)
    • Chip-level Performance Maximization using ASIS (Application-specific Interconnect Structure) Wiring Design Concept for 45nm node (2006)
    • A Novel Resistivity Measurement Technique for Scaled-down Cu Interconnects Implemented to Reliability-focused Automobile Applications (2007)
  • SEKINE Makoto ID: 9000004999534

    Oyama National College of Technology (1995 from CiNii)

    Articles in CiNii:2

    • A Study on Fractal Dimension of EEG under Mental Works (1994)
    • A Study on Fractal Dimension of AE Pulse Produced by a Cutting Procedure (1995)
  • SEKINE Makoto ID: 9000005543963

    Association of Super-Advanced Electronics Technologies (ASET):(Present address)Process & Manufacturing Engineering Center, Toshiba Corporation Semiconductor Comoany (2002 from CiNii)

    Articles in CiNii:11

    • Gate Oxide Breakdown Phenomena in Magnetron Plasma (1995)
    • A New High-Density Plasma Etching System Using A Dipole-Ring Magnet (1995)
    • Plasma-Wall Interactions In Dual Freguency Narrow-Gap Reactive Ion Etching System (1998)
  • SEKINE Makoto ID: 9000005596182

    Microelectronics Engineering Labs., Toshiba Corporation (1998 from CiNii)

    Articles in CiNii:1

    • Mechanism of Etch Stop in High Aspect-Ratio Contact Hole Etching (1998)
  • SEKINE Makoto ID: 9000005601529

    Microelectronics Engineering Lab., Toshiba Corporation (1999 from CiNii)

    Articles in CiNii:1

    • Mechanism of Highly Selective SiO_2 to Si_3N_4 Etching Using C_4F_8+CO Magnetron Plasma (1999)
  • SEKINE Makoto ID: 9000005845405

    Plasma Technology Laboratory, Association of Super-advanced Electronics Technologies(ASET) (2000 from CiNii)

    Articles in CiNii:1

    • In-situ Time-Resolved Infrared Spectroscopic Study of Silicon-Oxide Surface during Selective Etching over Silicon in Fluorocarbon Plasma (2000)
  • SEKINE Makoto ID: 9000016652186

    Department of Electrical Engineering and Computer Science, Nagoya University (2012 from CiNii)

    Articles in CiNii:4

    • Combinatorial Plasma Etching Process (2009)
    • Critical Factors for Nucleation and Vertical Growth of Two Dimensional Nano-Graphene Sheets Employing a Novel Ar^+ Beam with Hydrogen and Fluorocarbon Radical Injection (2010)
    • Ultrahigh-Speed Synthesis of Nanographene Using Alcohol In-Liquid Plasma (2012)
  • SEKINE Makoto ID: 9000017334697

    名古屋大学 (2010 from CiNii)

    Articles in CiNii:1

    • Dry Etching (2010)
  • SEKINE Makoto ID: 9000107334211

    Advanced ULSI Process Engineering Department, Process & Manufacturing Engineering Center, Toshiba Corporation (2001 from CiNii)

    Articles in CiNii:1

    • Profile Control of SiO _2 Trench Etching for Damascene Interconnection Process (2001)
  • SEKINE Makoto ID: 9000107338213

    Plasma Nanotechnology Research Center, Nagoya University (2011 from CiNii)

    Articles in CiNii:1

    • Laser Scattering Diagnosis of a 60-Hz Non-Equilibrium Atmospheric Pressure Plasma Jet (2011)
  • SEKINE Makoto ID: 9000107351245

    Department of Electrical Engineering and Computer Science, Nagoya University (2010 from CiNii)

    Articles in CiNii:1

    • Measurement of Hydrogen Radical Density and Its Impact on Reduction of Copper Oxide in Atmospheric-Pressure Remote Plasma Using H_2 and Ar Mixture Gases (2010)
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