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  • SHIRASAKA Jun ID: 9000005062171

    Kumamoto University (2005 from CiNii)

    Articles in CiNii:2

    • Non-destructive Evaluation of Solder Ball Joints in BGA Package by Infrared Thermography (2005)
    • Nondestructive Evaluation of BGA Joints in Electronic Devices with Infrared Thermography (2000)
  • Shirasaka Jun ID: 9000003813125

    Department of Mechanical Engineering and Materials Science, Kumamoto University (2000 from CiNii)

    Articles in CiNii:1

    • E101 DEVELOPMENT OF A COMPACT AND AN EFFICIENT ICE THERMAL ENERGY STORAGE VESSEL USING A LOW CONCENTRATION AQUEOUS SOLUTION : FUNDAMENTAL EXPERIMENTS(Energy storage, melting and solidification) : (2000)
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