Search Results1-20 of  86

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  • Shohji Ikuo ID: 9000015718900

    Articles in CiNii:1

    • Microstructures and Hardness of Mo Heater Chip Brazed with Au-18mass%Ni (Special Issue on Solidification Science and Processing for Advanced Materials) (2003)
  • Shohji Ikuo ID: 9000402926971

    Articles in CiNii:1

    • Effects of Ni Addition to Sn-5Sb High-Temperature Lead-Free Solder on Its Microstructure and Mechanical Properties (Special Issue on Frontier Researches Related to Interconnection, Packaging and Microjoining Materials and Microprocessing for Such Materials(Part 2)) (2019)
  • Shohji Ikuo ID: 9000403049599

    Articles in CiNii:1

    • A Study on Reliability of Pillar-Shaped Intermetallic Compounds Dispersed Lead-Free Solder Joint (2018)
  • SHOHJI Ikuo ID: 9000000496981

    Faculty of Engineering, Gunma University (2005 from CiNii)

    Articles in CiNii:4

    • Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders (2001)
    • Fatigue Damage Evaluation by Surface Feature for Sn-3.5Ag and Sn-0.7Cu Solders (2005)
    • Interface Reaction and Mechanical Properties of Lead-free Sn-Zn Alloy/Cu Joints (2002)
  • SHOHJI Ikuo ID: 9000001111107

    Faculty of Engineering, Gunma University (2003 from CiNii)

    Articles in CiNii:1

    • Microstructures and Hardness of Mo Heater Chip Brazed with Au-18 mass%Ni (2003)
  • SHOHJI Ikuo ID: 9000001209147

    Faculty of Engineering, Gunma University (2004 from CiNii)

    Articles in CiNii:1

    • Growth Kinetics of Reaction Layers in Flip Chip Joints with Cu-cored Lead-free Solder Balls (2004)
  • SHOHJI Ikuo ID: 9000001674983

    Department of Mechanical System Engineering, Graduate School of Engineering, Gunma University (2010 from CiNii)

    Articles in CiNii:4

    • Estimation of Thermal Fatigue Resistances of Sn-Ag and Sn-Ag-Cu Lead-Free Solders Using Strain Rate Sensitivity Index (2005)
    • Effect of Specimen Size and Aging on Tensile Properties of Sn-Ag-Cu Lead-Free Solders (2008)
    • Fluxless Bonding of Ni-P/Cu Plated Al Alloy and Cu Alloy with Lead-Free Sn-Cu Foil (2010)
  • SHOHJI Ikuo ID: 9000001711941

    Faculty of Engineering, Gunma University (2005 from CiNii)

    Articles in CiNii:2

    • Influence of an Immersion Gold Plating Layer on Reliability of a Lead-Free Solder Joint (2005)
    • Comparison of Lead-Free Solder Joints Made by Immersion Gold Plating with Those Produced by Autocatalytic Electroless Gold Plating (2005)
  • SHOHJI Ikuo ID: 9000001711955

    Faculty of Engineering, Gunma University (2005 from CiNii)

    Articles in CiNii:1

    • Reliability of Solder Joint with Sn-Ag-Cu-Ni-Ge Lead-Free Alloy under Heat Exposure Conditions (2005)
  • SHOHJI Ikuo ID: 9000002117769

    Department of Mechanical System Engineering, Graduate School of Engineering, Gunma University (2008 from CiNii)

    Articles in CiNii:1

    • Impact Properties of Lead-Free Sn-Ag-Cu-Ni-Ge Solder Joint with Cu Electrode (2008)
  • SHOHJI Ikuo ID: 9000002120126

    Faculty of Engineering, Gunma University (2008 from CiNii)

    Articles in CiNii:1

    • Electrodeposition of Ni-P Composite Films Using Watts Base Bath Containing Phosphorous Particles (2008)
  • SHOHJI Ikuo ID: 9000002843531

    Graduate School of Engineering, Gunma University (2012 from CiNii)

    Articles in CiNii:25

    • Joint Strength and Microstructure of SUS304 Brazed with Nickel-base Filler Metal for Heat Exchangers (2004)
    • Ultrasonic Bonding of Resin-Coated Cu Wire for High-Frequency Chip Coils (2004)
    • Whisker-Free Pb-Free Solder through Alloying (2006)
  • SHOHJI Ikuo ID: 9000002845967

    Card Engineering, Yasu, IBM Japan, Ltd.:(Present address)Gunma University (2001 from CiNii)

    Articles in CiNii:24

    • Growth Kinetics of Intermetallic Compounds on the Boundary between Au and In-48Sn Solder (1998)
    • Flip Chip Attach Technology for Fine Pitch Connection by In Alloy Solder (1997)
    • エレクトロニクス実装におけるマイクロ接合の潮流と将来展望 (2000)
  • SHOHJI Ikuo ID: 9000006671268

    Graduate School of Engineering, Gunma University (2012 from CiNii)

    Articles in CiNii:3

    • Dissolution Properties of Cu in Sn-Cu-Ni and Sn-Zn Lead-Free Alloys (2011)
    • 208 Interfacial reaction between Sn-Ag-Cu-Ni-Ge lead-free solder and Cu electrode (2006)
    • Effect of Ge and P Addition in Sn-Ag-Cu-Ni Lead-Free Solder on the Solder Joint Properties (2012)
  • SHOHJI Ikuo ID: 9000020643700

    Department of Mechanical Engineering, Gunma University (2011 from CiNii)

    Articles in CiNii:1

    • Influence of Processing Temperature on Boriding of SUS304 Stainless Steel by Al Added Fused Salt Bath (2011)
  • SHOHJI Ikuo ID: 9000020933825

    Graduate School of Engineering, Gunma University (2012 from CiNii)

    Articles in CiNii:1

    • The Influence of Additives in Electroless Nickel Plating Film on the Reliability of Solder Joint (2012)
  • SHOHJI Ikuo ID: 9000248240987

    Graduate School of Engineering, Gunma University (2013 from CiNii)

    Articles in CiNii:1

    • The Influence of Additives in Electroless Nickel Plating Film on the Reliability of Solder Joint (2013)
  • SHOHJI Ikuo ID: 9000254664623

    IBM Japan (1998 from CiNii)

    Articles in CiNii:1

    • Shear Property of Solders for Flip Chip Joining. (1998)
  • SHOHJI Ikuo ID: 9000254664684

    IBM Japan (1998 from CiNii)

    Articles in CiNii:1

    • Microstructure and Thermal Fatigue Behavior of Flip Chip Joint by Gold Bump. (1998)
  • SHOHJI Ikuo ID: 9000255716370

    Card Engineering, IBM Japan, Ltd. Yasu (1997 from CiNii)

    Articles in CiNii:1

    • Flip Chip Attach Technology for Fine Pitch Connection by In Alloy Solder. (1997)
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