Search Results1-15 of  15

  • TAMAHASHI Kunihiro ID: 9000005060262

    Hitachi Koki Co., Ltd. (1997 from CiNii)

    Articles in CiNii:1

    • Fluxless Soldering of Laminated Thin Metal Plates Using Au-Sn Alloy Solder (1997)
  • TAMAHASHI Kunihiro ID: 9000017479746

    Department of Materials Science and Engineering, Ibaraki University (2012 from CiNii)

    Articles in CiNii:3

    • Impact of High Heating Rate, Low Temperature, and Short Time Annealing on the Realization of Low Resistivity Cu Wire (2010)
    • Effect of Additive-Free Plating and High Heating Rate Annealing on the Formation of Low Resistivity Fine Cu Wires (2011)
    • Void Generation Mechanism in Cu Filling Process by Electroplating for Ultra Fine Wire Trenches (2012)
  • TAMAHASHI Kunihiro ID: 9000018823387

    Articles in CiNii:4

    • Current Status and Future Prospect of Cu Interconnects for Very High Speed LSIs (2011)
    • EBSD Analysis of Microstructures Along the Depth Direction in Very Narrow Cu Wires (2013)
    • 超高速LSI用低抵抗率Cu配線材料の研究 (特集 材料プロセスにおける分離操作と高純度精製) (2011)
  • TAMAHASHI Kunihiro ID: 9000248227453

    Department of Materials Science and Engineering, Ibaraki University (2013 from CiNii)

    Articles in CiNii:1

    • The Influence of Additive-Free Process on the Microstructure of Very Narrow Cu Wires in the Lower Region of a Trench (2013)
  • TAMAHASHI Kunihiro ID: 9000257977897

    Hitachi Research Laboratory, Hitachi Ltd. (1986 from CiNii)

    Articles in CiNii:1

    • HIGH RATE DEPOSITION OF a-Si: H FILMS BY RF PLANAR MAGNETRON SPUTTERING METHOD (1) —Effect of Magnetic Field— (1986)
  • TAMAHASHI Kunihiro ID: 9000257977993

    Hitachi Research Laboratory, Hitachi Ltd. (1987 from CiNii)

    Articles in CiNii:1

    • Investigation of Passivation Films for a-Si Photoreceptors (Ⅰ):—Properties of a-Si<sub>1-<i>x</i></sub>C<sub><i>x</i></sub>: H films— (1987)
  • TAMAHASHI Kunihiro ID: 9000257978020

    Hitachi Research Laboratory Hitachi Ltd. (1987 from CiNii)

    Articles in CiNii:1

    • Investigation of Passivation Films for a-Si : H Photoreceptors (Ⅱ):—Surface Modification of a-SiC : H Films by CF<sub>4</sub> Plasma Treatment— (1987)
  • TAMAHASHI Kunihiro ID: 9000257978073

    Hitachi Research Laboratory, Hitachi Ltd. (1988 from CiNii)

    Articles in CiNii:1

    • Investigation of Passivation Films for a-Si:H Photoreceptors(Ⅲ):— Properties of a-C Films — (1988)
  • TAMAHASHI Kunihiro ID: 9000317150703

    Faculty of Engineering, Ibaraki University (2016 from CiNii)

    Articles in CiNii:1

    • Grain Size Distribution at the Bottom Region in Very Narrow Cu Interconnects (2016)
  • Tamahashi Kunihiro ID: 9000020703265

    Department of Materials Science and Engineering, Ibaraki University (2011 from CiNii)

    Articles in CiNii:1

    • Current Status and Future Prospect of Cu Interconnects for Very High Speed LSIs (2011)
  • Tamahashi Kunihiro ID: 9000254664524

    Hitachi Koki Co.,Ltd. (1997 from CiNii)

    Articles in CiNii:1

    • Fluxless Soldering of Laminated Thin Metal Plates Using Au-Sn Alloy Solder. (1997)
  • Tamahashi Kunihiro ID: 9000257851328

    Department of Materials Science and Engineering, Ibaraki University (2010 from CiNii)

    Articles in CiNii:1

    • Impact of High Heating Rate, Low Temperature, and Short Time Annealing on the Realization of Low Resistivity Cu Wire (2010)
  • Tamahashi Kunihiro ID: 9000283291181

    Department of Materials Science and Engineering, Ibaraki University (2012 from CiNii)

    Articles in CiNii:1

    • Void Generation Mechanism in Cu Filling Process by Electroplating for Ultra Fine Wire Trenches (2012)
  • Tamahashi Kunihiro ID: 9000345256459

    Graduate School of Science and Engineering, Ibaraki University (2016 from CiNii)

    Articles in CiNii:1

    • Investigation on Microstructure and Resistivity in Cu-TSVs for 3D Packaging (2016)
  • Tamahashi Kunihiro ID: 9000388534797

    Graduate School of Science and Engineering, Ibaraki University (2018 from CiNii)

    Articles in CiNii:1

    • The Protrusion Behaviors in Cu-TSV during Heating and Cooling Process (2018)
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