Search Results1-20 of  21

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  • Terashima Shinichi ID: 9000287357296

    Articles in CiNii:1

    • Effect of Dispersoids in β-Sn Matrix on Creep Properties of Chip Scale Packages Joined by Sn-xAg-0.5 mass%Cu (x = 1, 2, 3 and 4 mass%) Solder Alloys （2015）
  • Shinichi TERASHIMA ID: 9000243595603

    Articles in CiNii:1

    • 卵巣摘出ラットの骨密度に対するスタチン長期投与に関する研究 （2005）
  • TERASHIMA Shinichi ID: 9000000408742

    Department of Physiology, University of the Ryukyus School of Medicine （1995 from CiNii）

    Articles in CiNii:1

    • Calcitonin gene-related peptide immunoreactivity in the trigeminal ganglion of Trimeresurus flavoviridis （1995）
  • TERASHIMA Shinichi ID: 9000000496998

    Advanced Technology Research Laboratories, Nippon Steel Corp. （2001 from CiNii）

    Articles in CiNii:1

    • Improvement in Thermal Reliability of a Flip Chip Interconnection System Joined by Pb-Free Solder and Au bumps （2001）
  • TERASHIMA Shinichi ID: 9000001209050

    Advanced Technology Research Laboratories, Nippon Steel Corp. （2004 from CiNii）

    Articles in CiNii:2

    • Improvement on Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu Flip Chip Interconnects by Nickel Addition （2004）
    • Low Cycle Fatigue Properties of Ni added Low Silver Content Sn-Ag-Cu Flip Chip Interconnects （2004）
  • TERASHIMA Shinichi ID: 9000001209056

    Advanced Technology Research Laboratories, Nippon Steel Corp. （2004 from CiNii）

    Articles in CiNii:1

    • Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu-xNi Flip Chip Interconnects （2004）
  • TERASHIMA Shinichi ID: 9000001233546

    Advanced Technology Research Laboratories, Nippon Steel Corp. （2004 from CiNii）

    Articles in CiNii:1

    • Recrystallization of Sn Grains due to Thermal Strain in Sn-1.2Ag-0.5Cu-0.05Ni Solder （2004）
  • TERASHIMA Shinichi ID: 9000014269319

    Nippon Steel Corporation, Advanced Technology Research Laboratories （2009 from CiNii）

    Articles in CiNii:1

    • Development of High Drop Shock Reliability Pb-free Solder Alloy LF35 （2009）
  • TERASHIMA Shinichi ID: 9000018531188

    Nippon Steel Corporation, Advanced Technology Research Laboratories （2011 from CiNii）

    Articles in CiNii:3

    • Development of Enhanced Bondability and Reliability Multi-Layer Cu Bonding Wire EX1 （2011）
    • 狭ピッチ用金ボンディングワイヤ (特集2 高機能化ニーズに応える半導体関連材料) （2001）
    • 高密度50μm狭ピッチ接続におけるワイヤボンディング接合技術の開発 (新素材特集) （2001）
  • Terashima Shinichi ID: 9000020720455

    Nippon Steel Corporation, Advanced Technology Research Laboratories （2011 from CiNii）

    Articles in CiNii:1

    • Development of Enhanced Bondability and Reliability Multi-Layer Cu Bonding Wire EX1 （2011）
  • Terashima Shinichi ID: 9000257842516

    Advanced Technology Research Laboratories, Nippon Steel Corporation （2004 from CiNii）

    Articles in CiNii:1

    • Low Cycle Fatigue Properties of Ni added Low Silver Content Sn-Ag-Cu Flip Chip Interconnects （2004）
  • Terashima Shinichi ID: 9000257842518

    Advanced Technology Research Laboratories, Nippon Steel Corp. （2004 from CiNii）

    Articles in CiNii:1

    • Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu-<i>x</i>Ni Flip Chip Interconnects （2004）
  • Terashima Shinichi ID: 9000257842520

    Advanced Technology Research Laboratories, Nippon Steel Corp. （2004 from CiNii）

    Articles in CiNii:1

    • Improvement on Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu Flip Chip Interconnects by Nickel Addition （2004）
  • Terashima Shinichi ID: 9000257842593

    Advanced Technology Research Laboratories, Nippon Steel Corp. （2004 from CiNii）

    Articles in CiNii:1

    • Recrystallization of Sn Grains due to Thermal Strain in Sn-1.2Ag-0.5Cu-0.05Ni Solder （2004）
  • Terashima Shinichi ID: 9000263042017

    Advanced Technology Research Laboratories, Nippon Steel & Sumitomo Metal Corporation （2014 from CiNii）

    Articles in CiNii:1

    • Prediction of Intermetallic Compound Formation Sequences in Pseudo Binary Diffusion Couples: Experimental Examinations for (Sn-<i>x</i>Zn)/Cu (<i>x</i> = 2, 5, 10, 15, 20 and 25 mass%) by a Kinetic Model with Thermodynamic Data Using MDR Diagram （2014）
  • Terashima Shinichi ID: 9000316688715

    Advanced Technology Research Laboratories, Nippon Steel & Sumitomo Metal Corporation （2015 from CiNii）

    Articles in CiNii:1

    • Effect of Dispersoids in β-Sn Matrix on Creep Properties of Chip Scale Packages Joined by Sn-<i>x</i>Ag-0.5 mass%Cu (<i>x</i> = 1, 2, 3 and 4 mass%) Solder Alloys （2015）
  • Terashima Shinichi ID: 9000398963981

    KEK （2017 from CiNii）

    Articles in CiNii:1

    • Performance evaluation of KAGRA Cryogenic Payload （2017）
  • Terashima Shinichi ID: 9000398964756

    KEK （2017 from CiNii）

    Articles in CiNii:1

    • Development and Characterization of Optical Follower Servo for Photon Calibrator （2017）
  • Terashima Shinichi ID: 9000402478791

    KEK （2018 from CiNii）

    Articles in CiNii:1

    • Status of KAGRA Cryogenics III(Installation and cooling of cryogenic mirror payload on KAGRA site) （2018）
  • Terashima Shinichi ID: 9000404793777

    KEK （2018 from CiNii）

    Articles in CiNii:1

    • Fabrication of sapphire fibers and evaluation of thermal conductivity of them in KAGRA （2018）
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