Search Results1-20 of  187

  • TOMITA YOSHIHIRO ID: 9000001017872

    Department of Orthopedic Surgery, Suzuka Kaisei Hospital (1996 from CiNii)

    Articles in CiNii:1

    • Long-Term follow up of patients with conservatively treated Kienbock's disease (1996)
  • TOMITA YOSHIHIRO ID: 9000001301046

    Association of Super-Advanced Electronics Technologies (ASET), Electronic System Integration Technology Research Department, Tsukuba Research Center, Tsukuba Center Inc. (2003 from CiNii)

    Articles in CiNii:2

    • Cu Bump Interconnections in 20 μm-Pitch at Low Temperature Utilizing Electroless Tin-Plating on 3D Stacked LSI (2003)
    • Micro Bump Interconnection Technologies in 20μm Pitch on 3D System in Package (2001)
  • TOMITA YOSHIHIRO ID: 9000002074439

    Department of Urology, Fukuoka University School of Medicine (2002 from CiNii)

    Articles in CiNii:1

    • TRANSSACRAL APPROACH ; ITS USEFULNESS IN THE SURGICAL TREATMENT OF RECTOURETHRAL FISTULAS AND SEMINAL VESICLE CYSTS (2002)
  • TOMITA YOSHIHIRO ID: 9000004648279

    Articles in CiNii:7

    • RESULTS OF 24 CASES OF LIVING RELATED RENAL TRANSPLANTATION IN FUKUOKA UNIVERSITY HOSPITAL (2005)
    • BLADDER CANCER IN A LIVER AND KIDNEY TRANSPLANT RECIPIENT : A CASE REPORT (2004)
    • ANALYSIS AND DIAGNOSIS OF HEMATURIA IN AN OUTPATIENT CLINIC (1996)
  • TOMITA YOSHIHIRO ID: 9000020530101

    Articles in CiNii:1

    • Three dimensional thermoviscoplastic deformation behavior of blocks under uniaxial tension. (1989)
  • TOMITA Yoshihiro ID: 9000000398398

    Department of Endodontics, Tokyo Dental College (1997 from CiNii)

    Articles in CiNii:1

    • SEM Observations of Resected Root Canal Ends fillowing Apicocectomy (1997)
  • TOMITA Yoshihiro ID: 9000000688665

    First Department of Biochemistry, School of Medicine, Fukuoka University (2000 from CiNii)

    Articles in CiNii:3

    • Molecular Identification of a Human Carcinoma-associated Glycoprotein Antigen Recognized by Mouse Monoclonal Antibody FU-MK-1 (2000)
    • Site-specific Localization of Epstein-Barr Virus in Pharyngeal Carcinomas (1998)
    • EPSTEIN-BARR VIRUS AND MALIGNANT LYMPHOMA (1998)
  • TOMITA Yoshihiro ID: 9000001004494

    Nippon Grease Co., LTD. (2006 from CiNii)

    Articles in CiNii:2

    • Measurements of Cooling Curves for Quenching Media (1995)
    • Vacuum Heat Treating Oil (2006)
  • TOMITA Yoshihiro ID: 9000001380594

    ASET (Association of Super-Advanced Electronics Technologies) (2004 from CiNii)

    Articles in CiNii:8

    • Feasibilities on Ultrasonic Flip-Chip Bonding in 20 μm-pitch for COC Structure (2003)
    • Feasibilities on Microthin Underfill Technologies for Gap Less than 10.MU.m Applied to Flip-Chip Bonding in 20.MU.m Pitch. (2001)
    • Feasibilities on Ultrasonic Flip-Chip Bonding in 20 .MU.m-pitch for COC Structure. (2003)
  • TOMITA Yoshihiro ID: 9000001712563

    Department of Mechanical Engineering, Faculty of Science and Engineering, Kinki University (2006 from CiNii)

    Articles in CiNii:1

    • New Compo-Casting Method of Ceramics Inserted Cast Iron Reducing Thermal Stress (2006)
  • TOMITA Yoshihiro ID: 9000001951118

    Faculty of Engineering, Fukui University of Technology (2012 from CiNii)

    Articles in CiNii:6

    • Phase-Field Simulation of Austenite to Ferrite Transformation and Widmanstatten Ferrite Formation in Fe-C Alloy (2006)
    • Multi-Phase-Field Model to Simulate Microstructure Evolutions during Dynamic Recrystallization (2008)
    • Free Energy Problem for the Simulations of the Growth of Fe_2B Phase Using Phase-Field Method (2008)
  • TOMITA Yoshihiro ID: 9000002365405

    Kinki University (2006 from CiNii)

    Articles in CiNii:29

    • Al-Si系合金の固液共存状態を利用したダイカスト法における改良剤としてのミッシュメタルの影響 (1995)
    • Al中間層を用いた鋳鉄とセラミックスの接合強度に及ぼす保持時間の影響 (1995)
    • 鋳鉄におけるチル臨界冷却速度の1点測定法に関する検討 (1995)
  • TOMITA Yoshihiro ID: 9000003084202

    Articles in CiNii:6

    • 三次元積層実装LSIにおける微細間隙封止技術の開発 (MES2000 第10回マイクロエレクトロニクスシンポジウム) (2000)
    • 三次元積層LSIにおける微細間隙封止樹脂の最適化 (2001)
    • 微細ピッチ三次元積層構造における非破壊解析技術の検証 (2001)
  • TOMITA Yoshihiro ID: 9000003628177

    Dept. Mech. Engng. Fac. Engng., Kobe Univ. (2001 from CiNii)

    Articles in CiNii:4

    • 2-4 埋込み座標系であらわした弾塑性材料の応力-ひずみ関係について (1971)
    • 大ひずみ大変形の増分理論とそれによる有限要素法 (1972)
    • 薄板の大変形問題の有限要素法による弾塑性解析 : 第2報,非軸対称薄板の大変形問題の膜理論による解析と実験 (1978)
  • TOMITA Yoshihiro ID: 9000003702336

    Osaka University, (1974 from CiNii)

    Articles in CiNii:1

    • A Moire Method for Plane Large Strain and Large Displacement Problem (1974)
  • TOMITA Yoshihiro ID: 9000003799550

    熊本大学大学院自然科学研究科 (2016 from CiNii)

    Articles in CiNii:4

    • Phase Field Simulation of Dendritic Growth Between Fibers (2002)
    • Phase Field Simulation of Grain Growth of Polycrystalline Metals (2003)
    • Phase Field Simulation of Grain Growth of Polycrystalline Metals (2004)
  • TOMITA Yoshihiro ID: 9000003800583

    Grad. Sch. Sci., Tech., Kobe Univ. (2003 from CiNii)

    Articles in CiNii:1

    • 516 Characterization of Micro- to Macroscopic Response of Trinary Polymer System (2003)
  • TOMITA Yoshihiro ID: 9000004745680

    Packaging Technology Development Dept., Renesas Technology Corporation (2004 from CiNii)

    Articles in CiNii:3

    • 超音波フリップチップボンディング技術を用いたチップオンチップ構造パッケージ開発 (2003)
    • Development of the Chip on Chip structure Package Utilizing Ultrasonic Flip-Chip Bonding (2004)
    • Development of the Chip on Chip structure Package Utilizing Ultrasonic Flip-Chip Bonding (2004)
  • TOMITA Yoshihiro ID: 9000004763927

    Device Engineering Development Center, Matsushita Electric Industrial Co., Ltd. (1998 from CiNii)

    Articles in CiNii:5

    • Direct Bonding of Piezoelectric Materials (1995)
    • Piezoelectric Crystal on Silicon Technique : Direct-bonding Type Piezoelectric Crystal Device (1995)
    • Vibration Modes of Quartz on Silicon (QOS) Resonators : using X-ray-diffraction Topograph and Mode Analysis (1995)
  • TOMITA Yoshihiro ID: 9000004776820

    Articles in CiNii:4

    • 2,000ピン級超多ピンパッケージ技術 (特集 システムLSI) -- (基盤技術) (1999)
    • Thermally Enhanced Flip-chip BGA with Organic Substrate (1998)
    • Thermally Enhanced Flip-chip BGA with Organic Substrate (1998)
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