Search Results1-20 of  41

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  • TSUKUI Tsutomu ID: 9000001404788

    Department of Electrical Engineering, Faculty of Engineering, Tokai University (1997 from CiNii)

    Articles in CiNii:1

    • Preparation of nickel-metal hydride battery for a solar car (1997)
  • TSUKUI Tsutomu ID: 9000002251955

    Department of Electrical Engineering, School of Engineering (1995 from CiNii)

    Articles in CiNii:1

    • Ion Migration and Evaluation Method of Insulation Reliability for Printed Wiring Boards (1995)
  • TSUKUI Tsutomu ID: 9000002252256

    Department of Electrical Engineering, School of Engineering (1997 from CiNii)

    Articles in CiNii:1

    • A Statistical Analysis of the Breakdown Voltage of the Insulation Systems for Rotating Machines (1997)
  • TSUKUI Tsutomu ID: 9000002252667

    Department of Electrical Engineering (1999 from CiNii)

    Articles in CiNii:2

    • Improvement of Performance for Polymer Electrolyte Fuel Cell (1999)
    • Performance Improvement of Direct Methanol Fuel Cell (1999)
  • TSUKUI Tsutomu ID: 9000002253102

    Department of Electrical Engineering (2001 from CiNii)

    Articles in CiNii:1

    • Performance Improvement of Polymer Electrolyte Fuel Cell by Analyzing Single Electrode Characteristics (2001)
  • TSUKUI Tsutomu ID: 9000002376285

    Research Lab. (2012 from CiNii)

    Articles in CiNii:46

    • Analysis of Ionic Migration on PWBs by Means of Dielectric Property Measurement (1997)
    • Recent Trend of Reliability Technology-Preface (1997)
    • Status and Trends of Insulation Reliability Analysis (1997)
  • TSUKUI Tsutomu ID: 9000018198673

    Research Lab. TSUKUI (2012 from CiNii)

    Articles in CiNii:5

    • Dielectric Properties of Major Nanocomposites (II) (2008)
    • Current State of Electrochemical Migration Test (2010)
    • Prevention Method for Electrochemical Migration on Lead Free (2012)
  • TSUKUI Tsutomu ID: 9000255716703

    School of Engineering, Tokai University (2000 from CiNii)

    Articles in CiNii:1

    • Subject of Lead Free Solder: Electrical & Mechanical Reliability (2000)
  • TSUKUI Tsutomu ID: 9000255717052

    Tokai University (2005 from CiNii)

    Articles in CiNii:1

    • Insulation Deterioration and the Prevention Method by Electrochemical Migration of Electric Equipment (Pt.2) (2005)
  • TSUKUI Tsutomu ID: 9000256072253

    Hitachi Research Laboratory, Hitachi Ltd. (1994 from CiNii)

    Articles in CiNii:1

    • Origins of Ion Migration Patterns in Printed Wiring Boards. (1994)
  • TSUKUI Tsutomu ID: 9000256072661

    School of Engineering, Tokai University (1997 from CiNii)

    Articles in CiNii:1

    • Analysis of Ionic Migration on PWBs by Means of Dielectric Property Measurement. (1997)
  • TSUKUI Tsutomu ID: 9000256072717

    School of Engineering, Tokai University (1997 from CiNii)

    Articles in CiNii:1

    • Recent Trend of Reliability Technology-Preface (1997)
  • TSUKUI Tsutomu ID: 9000256072751

    School of Engineering, Tokai University (1997 from CiNii)

    Articles in CiNii:1

    • Recent Trend of Reliability Technology. Status and Trends of Insulation Reliability Analysis. (1997)
  • TSUKUI Tsutomu ID: 9000256072772

    School of Engineering, Tokai University (1997 from CiNii)

    Articles in CiNii:1

    • Trends in High Density Packaging Technologies. Trends in Evaluation of Reliability with High Density Packaging Technologies-Present and Future in Evaluation of Reliability.:—Present and Future in Evaluation of Reliability— (1997)
  • TSUKUI Tsutomu ID: 9000256073224

    Research Lab.TSUKUI (2008 from CiNii)

    Articles in CiNii:1

    • 3D High Performance Packaging of Electronic Equipments and Guaranteed Reliability (2008)
  • TSUKUI Tsutomu ID: 9000256073303

    School of Engineering, Tokai University (1999 from CiNii)

    Articles in CiNii:1

    • Intention to Special Edition (1999)
  • TSUKUI Tsutomu ID: 9000256073334

    School of Engineering, Tokai University (1999 from CiNii)

    Articles in CiNii:1

    • Trends of Inspection & Reliability Technologies. Reliability for High Density Packaging & Interconnection of Electronics Apparatus. (1999)
  • TSUKUI Tsutomu ID: 9000256073634

    School of Information Technology and Electronics, Tokai University (2001 from CiNii)

    Articles in CiNii:1

    • Intention to Special Edition (2001)
  • TSUKUI Tsutomu ID: 9000256074190

    Department of Electrical and Electronic Engineering, Tokai University (2003 from CiNii)

    Articles in CiNii:1

    • Factor Analysis of Electrochemical Migration Deterioration of Lead-Free Solders (2003)
  • TSUKUI Tsutomu ID: 9000256074212

    Department of Electrical and Electronic Engineering, Tokai University (2003 from CiNii)

    Articles in CiNii:1

    • Evaluation of Low Temperature Lead-Free Solder Using Corrosion Tests (2003)
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