Search Results1-20 of  27

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  • YOSHIOKA Sumio ID: 9000003631880

    三菱電機 (2004 from CiNii)

    Articles in CiNii:4

    • 233 金属材料疲労データに対する S-N 曲線回帰法 : 材料学会標準に向けて (2001)
    • Proposal of Standard Regression Method for S-N Curve Based on Fatigue Test Data for Metallic Materials (2002)
    • Computer Aided Fatigue Design System (2003)
  • YOSHIOKA Sumio ID: 9000004562013

    Advanced Technology R&D Center, Mitsubishi Electric Corp. (1997 from CiNii)

    Articles in CiNii:1

    • Analyses of Delamination Arrest Effect of Dimples on Interface in LSI Package (1997)
  • YOSHIOKA Sumio ID: 9000020031759

    Articles in CiNii:1

    • Spin Burst Strength of Rotating Discs(2nd Report, Evaluation by J<SUB>IC</SUB>) (1979)
  • YOSHIOKA Sumio ID: 9000020147078

    Articles in CiNii:1

    • Fatigue Crack Growth Threshold (ΔK<SUB>th</SUB>) under Mode III : The Effect of Stress Ratio and Mixed Mode (1984)
  • YOSHIOKA Sumio ID: 9000020213518

    Articles in CiNii:1

    • Evaluation of High Temperature Cyclic Deformation of a Cast-Heat-Resistant Alloy. (1992)
  • YOSHIOKA Sumio ID: 9000020243212

    Articles in CiNii:1

    • Dynamic Behavior of CRT under Impact Loading. (1992)
  • YOSHIOKA Sumio ID: 9000020252893

    Articles in CiNii:1

    • Fundamental study on initiation condition of creep crack growth. (1987)
  • YOSHIOKA Sumio ID: 9000020295830

    Articles in CiNii:1

    • Spin Burst Strength of Rotating Discs (1st Report, Evaluation by K<SUB>IC</SUB>) (1979)
  • YOSHIOKA Sumio ID: 9000020464315

    Articles in CiNii:1

    • Boundary Element Heat Conduction and Thermoelastic Analyses of Interface Crack in LSI Package in Consideration of Contact Between Crack Surfaces. (1992)
  • YOSHIOKA Sumio ID: 9000020464739

    Articles in CiNii:1

    • Stochastic Finite Element Analysis of Thermal Deformation of Electronic Device Mounted on Circuit Board. (1991)
  • YOSHIOKA Sumio ID: 9000020590668

    Articles in CiNii:1

    • Boundary element analysis of steady-state heat conduction and thermal stresses in the LSI package. (1989)
  • YOSHIOKA Sumio ID: 9000021135818

    Articles in CiNii:1

    • Evaluation of Fatigue Damage in Surface Mount Solder Joints. Study of Evaluation Mothod.:Study of Evaluation Method (1991)
  • YOSHIOKA Sumio ID: 9000021149038

    Articles in CiNii:1

    • Fatigue strength at toe of welded joint. (1989)
  • YOSHIOKA Sumio ID: 9000021157751

    Articles in CiNii:1

    • Low cycle fatigue properties of solder material (36Pb62Sn2Ag) at low temperatures. (1990)
  • YOSHIOKA Sumio ID: 9000021158507

    Articles in CiNii:1

    • Fatigue crack growth rate of structural materials for cryogenic use. (1989)
  • YOSHIOKA Sumio ID: 9000021165831

    Articles in CiNii:1

    • Impact strength for notched high strength steel. (1985)
  • YOSHIOKA Sumio ID: 9000021176778

    Articles in CiNii:1

    • High temperature high-cycle fatigue behavior of superalloy. (1987)
  • YOSHIOKA Sumio ID: 9000021403679

    Articles in CiNii:1

    • Fatigue Crack Growth Behavior in Hydrogen Gas Environment (1983)
  • YOSHIOKA Sumio ID: 9000021462085

    Articles in CiNii:1

    • Effect of Hydrogen Gas Environment on Fatigue Crack Growth in Ni-Mo-V Steels (1980)
  • YOSHIOKA Sumio ID: 9000021462556

    Articles in CiNii:1

    • Evaluation of Thermal Fatigue Strength in Lap Type Solder Joints (1981)
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