Search Results1-8 of  8

  • YOSHIZAWA Keisuke ID: 9000004547049

    Software Development Center, Shimadzu Corporation (2002 from CiNii)

    Articles in CiNii:1

    • Method to Estimate Development Effort for Embedded Software from Scale Points (2002)
  • YOSHIZAWA Keisuke ID: 9000006671270

    Graduate School of Engineering, Gunma University (2008 from CiNii)

    Articles in CiNii:2

    • Thermal Fatigue Life Evaluation of Lead-Free Solder Joint of Chip Size Package with Underfill (2008)
    • 209 Evaluation of thermal stress relief in lead-free solder joint for chip size package by finite element analysis (2006)
  • YOSHIZAWA Keisuke ID: 9000257864666

    Cryogenic Systems Laboratory, Maglev Systems Technology Division (2014 from CiNii)

    Articles in CiNii:1

    • <b>Characteristics of a Magnetic Refrigerator with New Magnetocaloric Materials</b> (2014)
  • YOSHIZAWA Keisuke ID: 9000309984942

    Graduate School of Yamaguchi University (2014 from CiNii)

    Articles in CiNii:2

    • Relation between Switching Power Source and Power Transfer Portion in a WPT System for Robot Fish in Aquarium (2014)
    • Improvement of WPT efficiency for ornamental robot fish and its future application to capsule endoscopes (2014)
  • YOSHIZAWA Keisuke ID: 9000348875874

    Articles in CiNii:6

    • Investigation on Large Gap PMSM Using Dual Halbach Arrays for Generator Motor of Flywheel Energy Storage System with Superconducting Magnetic Bearings (2012)
    • Investigation on Large Gap PMSM Using Dual Halbach Arrays for Generator Motor of Flywheel Energy Storage System with Superconducting Magnetic Bearings (2012)
    • Development of Permanent Magnet Synchronous Motor Driving for Superconducting Flywheel Energy Storage System (2013)
  • YOSHIZAWA Keisuke ID: 9000396163884

    Seikei University (2018 from CiNii)

    Articles in CiNii:1

    • Biocompatibility of titanium oxide thin film deposited by reactive sputtering (2018)
  • Yoshizawa Keisuke ID: 9000018483027

    Articles in CiNii:1

    • Influence of Magnetic Property of Ferromagnetic Shield on High Field Magnet Analysis (2011)
  • Yoshizawa Keisuke ID: 9000257857350

    Graduate School of Engineering, Gunma University (2008 from CiNii)

    Articles in CiNii:1

    • Thermal Fatigue Life Evaluation of Lead-Free Solder Joint of Chip Size Package with Underfill (2008)
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