Surface Finishing Technology and Semiconductor Fabrication Process. Effect of Water Absorption of Dietectric Underlayers on Textures and Reliabiity in Al-Si-Cu/Ti/TiN/Ti Layered Interconnects.

• YOSHIDA Tomoyuki

  TOYOTA Central R&D Labs., Inc.

• OHWAKI Takeshi

  TOYOTA Central R&D Labs., Inc.

Bibliographic Information

Other Title

• 表面技術と半導体プロセス　　Ａｌ‐Ｓｉ‐Ｃｕ／Ｔｉ／ＴｉＮ／Ｔｉ積層配線の結晶配向性と信頼性に及ぼす下地絶縁吸湿の影響
• Al-Si-Cu Ti TiN Ti セキソウ ハイセン ノ ケッショウ ハイ

Journal

• Journal of The Surface Finishing Society of Japan

  Journal of The Surface Finishing Society of Japan 49 (3), 266-272, 1998

  The Surface Finishing Society of Japan

Keywords

• Al-Alloy
• Interconnect
• Electromigration
• Water Absorption
• Texture

Details

• CRID: 1390001204114936448
• NII Article ID: 10002108746
• NII Book ID: AN1005202X
• DOI: 10.4139/sfj.49.266
• ISSN: 18843409
• ISSN: 09151869
• NDL BIB ID: 4413778
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I4413778
• Text Lang: ja
• Data Source:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles