Ｓｎ不純物を含む銅電析皮膜のＴＥＭならびにＥＳＣＡ観察

• 横田 俊子

  秋田大学大学院

• 金児 紘征

  秋田大学鉱山学部

• 半澤 規子

  三井金属鉱業 (株) 総合研究所

• 土橋 誠

  三井金属鉱業 (株) 総合研究所

• 青木 善平

  三井金属鉱業 (株) 総合研究所

書誌事項

タイトル別名

• TEM and ESCA Observations of Copper Deposits Containing Tin Impurities.
• Sn フジュンブツ オ フクム ドウ デンセキ ヒマク ノ TEM ナラビニ

抄録

TEM and ESCA observations have been used to study copper crystallite sizes, tin and oxygen atom concentration distributions, tin oxidation, and the crystal structure of tin oxide, compared to electrolytic polycrystalline copper deposits with no impurity atoms (pure copper deposits). The 0.003wt%Sn-Cu alloy deposited in a copper electrolyte containing a tin additive of 1g/dm³ showed almost the same results as the pure copper deposit. For the 1.10wt%Sn-Cu alloy produced in an electrolyte containing a tin additive of 10g/dm³, tin atoms were found to be incorporated into copper deposits in both metallic and oxidation states. Tin oxide particles (SnO₂) having a rutile (or C4) tetragonal structure were observed to be a smooth and elliptical, 2-5nm in size, and almost homogeneously dispersed as clusters of several particles inside copper deposits.<br>We also sound in nm-order SnO₂ particle incorporation that particles form in the copper electrolyte and are concomitantly introduced into copper deposits during alloy electrodeposition.

収録刊行物

• 表面技術

  表面技術 49 (5), 519-524, 1998

  一般社団法人 表面技術協会

キーワード

• TEM
• ESCA
• Copper Deposit
• Tin Impurity
• SnO₂

詳細情報

• CRID: 1390282679091101312
• NII論文ID: 10002109351
• NII書誌ID: AN1005202X
• DOI: 10.4139/sfj.49.519
• ISSN: 18843409
• ISSN: 09151869
• NDL書誌ID: 4481832
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I4481832
• 本文言語コード: ja
• データソース種別:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可