New Technologies for Scaled-down Cu Interconnection in Ultra-Large Scale Integrated Circuits. High-rate Deposition of CVD-Cu Film.

• KOBAYASHI Akiko

  ANELVA Corp., Process Res. and Dev.

Bibliographic Information

Other Title

• ＵＬＳＩ微細Ｃｕ配線技術の新しい展開　　ＣＶＤ‐Ｃｕ膜の高速成膜
• CVD-Cuマク ノ コウソクセイマク

Journal

• Journal of The Surface Finishing Society of Japan

  Journal of The Surface Finishing Society of Japan 49 (11), 1192-1195, 1998

  The Surface Finishing Society of Japan

Keywords

• Metallization
• Copper
• CVD
• Deposition Rate

Details

• CRID: 1390282679090769792
• NII Article ID: 10002111031
• NII Book ID: AN1005202X
• DOI: 10.4139/sfj.49.1192
• ISSN: 18843409
• ISSN: 09151869
• NDL BIB ID: 4603781
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I4603781
• Text Lang: ja
• Data Source:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles