BGAパッケージ用テープ基板における無電解金めっき厚さとワイヤボンディング性およびはんだボール接合性 Influence of Electroless Gold Plating Thickness on Wire Bondability and Ball Solderability on Tape Substrate for BGA Packages
Tape carriers have been used as BGA substrates because of their thin, fine circuits and high manufacturing accuracy. Electroless gold plating on tape carriers has become required. Electroless gold plating tape carriers having good gold wire bondability and ball solderability are being developed. We studied the influence of electroless gold plating thickness on wire bondability and ball solderability, with the following results: (1) The pull strength of gold wires on tape carriers with 0.2μm and over gold plating thickness was 0.07N or more. (2) The shear strength of solder balls on tape carriers with 0.2μm and below gold plating thickness was 3N or more after heat aging at 150°C for 500h. (3) Tape carriers with 0.2μm gold plating film had good wire bondability and ball solderability.
- 表面技術 = The Journal of the Surface Finishing Society of Japan
表面技術 = The Journal of the Surface Finishing Society of Japan 49(12), 1291-1297, 1998-12-01
The Surface Finishing Society of Japan