Influence of Basic Component of plating Bath. Electrolytic Copper Plating.

• NISHIHAMA Yukio

  Okuno Chemical Industries Co, Ltd

Bibliographic Information

Other Title

• めっきの基本組成の役割　　電気銅めっき
• デンキ ドウメッキ

Journal

• Journal of The Surface Finishing Society of Japan

  Journal of The Surface Finishing Society of Japan 50 (2), 135-139, 1999

  The Surface Finishing Society of Japan

Keywords

• Electrolytic Copper Plating

Details

• CRID: 1390001204115096704
• NII Article ID: 10002111742
• NII Book ID: AN1005202X
• DOI: 10.4139/sfj.50.135
• ISSN: 18843409
• ISSN: 09151869
• NDL BIB ID: 4657419
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I4657419
• Text Lang: ja
• Data Source:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles