Deposition Mechanism of Electroless Pd Plating Using Formic Acid as a Reducing Agent.

• UCHIDA Ei

  ISHIHARA Chemical Co., Ltd.

• OKADA Takashi

  ISHIHARA Chemical Co., Ltd.

• NAWAFUNE Hidemi

  Fac. of Sci., Konan Univ.

• NAKAO Seiichiro

  Fac. of Sci., Konan Univ.

• MIZUMOTO Shozo

  Fac. of Sci., Konan Univ.

Bibliographic Information

Other Title

• ギ酸を還元剤とする無電解パラジウムめっきの析出機構

Journal

• Journal of The Surface Finishing Society of Japan

  Journal of The Surface Finishing Society of Japan 50 (5), 469-470, 1999

  The Surface Finishing Society of Japan

Keywords

• Electroless Pd Plating
• Formic Acid
• Mass Balance
• Deposition Mechanism

Details

• CRID: 1390001204114577408
• NII Article ID: 10002112581
• NII Book ID: AN1005202X
• DOI: 10.4139/sfj.50.469
• COI: 1:CAS:528:DyaK1MXjt1agu7s%3D
• ISSN: 18843409
• ISSN: 09151869
• ISSN: http://id.crossref.org/issn/09151869
• Text Lang: ja
• Data Source:
  • JaLC
  • Crossref
  • CiNii Articles