ダブルパルス法によるCu/Co多層膜の電析 Cu/Co Multilayer Electrodeposition with Dual-Pulsed Current
Cu/Co multilayer electrodeposition has been studied using a dual-pulsed current from pyrophosphate solutions. A pure copper layer is obtained with a current density lower than the diffusion-limited one of cupric ion. The cobalt content in the alloy layer increases with applied current density, and reaches about 95at.%. When the copper layer becomes thicker than 20nm and the alloy layer thicker than 15nm, the multilayer film becomes smooth. The well-defined modulation in the copper and cobalt composition was observed for Cu/Co multilayer deposits by Auger electron spectroscopy with Ar sputtering. The copper-content depth profile varies within the alloy layer, when the alloy layer is quite thin at a few nanometers. This compositional variation may be due to diffusion-layer disorder by hydrogen evolution or the cobalt hydroxide film formation on deposits.
- 表面技術 = The Journal of the Surface Finishing Society of Japan
表面技術 = The Journal of the Surface Finishing Society of Japan 47(7), 623-627, 1996-07
The Surface Finishing Society of Japan