銅電析皮膜の表面形態と機械的性質におよぼす不純物の影響

• 横田 俊子

  秋田大学大学院

書誌事項

タイトル別名

• Impurity Effect on Surface Morphologies and Mechanical Properties of Copper Deposits.
• ドウ デンセキ ヒマク ノ ヒョウメン ケイタイ ト キカイテキ セイシツ ニ

抄録

We studied how impurities-Cr, Fe, Co, Ni, Zn, Ag, Cd and Sn-in electrolytes, prepared with recycled copper, affect surface morphology and mechanical properties, i.e., tensile strength and elongation-of electrolytic polycrystalline copper deposlts, 35μm thick. In additive concentrations of 0.001 to 10g/dm³, we found that Cr, Fe, Co, Ni, Zn and Cd are not introduced into copper deposits. In contrast, Ag and Sn were found in copper deposits at an Ag additive concentration exceeding 0.01g/dm³ and a Sn additive concentration exceeding 10g/dm³. Copper deposit morphology was characterized by the presence of large numbers of bumps surrounded by crystallographical planes and their (220) preferential orientation. For the Sn additive concentration of 10g/dm³, however, surface morphology consisted of fine semispherical bumps and an almost random orientation distribution. The tensile strength of copper deposits was found to depend strongly on copper crystallite size, independent of orientation.

収録刊行物

• 表面技術

  表面技術 48 (11), 1109-1114, 1997

  一般社団法人 表面技術協会

キーワード

• Impurity Incorporation
• Surface Morphology
• Mechanical Property
• Copper Deposit

詳細情報

• CRID: 1390282679092590720
• NII論文ID: 10002260264
• NII書誌ID: AN1005202X
• DOI: 10.4139/sfj.48.1109
• ISSN: 18843409
• ISSN: 09151869
• NDL書誌ID: 4334602
• Web Site: https://ndlsearch.ndl.go.jp/books/R000000004-I4334602
• 本文言語コード: ja
• データソース種別:
  • JaLC
  • NDL
  • Crossref
  • CiNii Articles
• 抄録ライセンスフラグ: 使用不可