Rate of Oxidation of Impurity in Liquid Copper by the Oxidizing Gas.

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Other Title
  • 酸化性ガスによる容銅中不純物の酸化除去速度
  • 酸化性ガスによる溶銅中不純物の酸化除去速度
  • サンカセイ ガス ニ ヨル ヨウドウ チュウ フジュンブツ ノ サンカ ジョキョ ソクド

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Abstract

The kinetic behavior of oxidation of impurities (Zn, Sn and Pb) in liquid copper was investigated by blowing air onto the liquid copper surface. The oxidation of only Zn and Sn proceeded at the early stage of experiment. As Zn and Sn contents decreased, the oxygen content in copper increased and then the oxidation of Pb started after the oxygen content reached some critical value. The oxidation rates of impurities and the formation of Cu2O-based slag were promoted with increasing the blowing rate of air. Lower temperature favored the removal of Zn and Sn, but it was difficult to lower the contents of Zn, Sn, and specially, Pb down to less than 0.01 mass % only by blowing air. A kinetic reaction model was developed based on two film theory. The experimental results were confirmed to be interpreted by this model.

Journal

  • Shigen-to-Sozai

    Shigen-to-Sozai 115 (6), 455-459, 1999

    The Mining and Materials Processing Institute of Japan

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