Analyses of Pinning Stress during the Interaction between Grain Boundary and Particle Simulated by the Finite Element Method

  • Kim Byung-Nam
    Mechanical Properties Division, National Research Institute for Metals
  • Kishi Teruo
    Research Center for Advanced Science and Technology, The University of Tokyo

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Other Title
  • 粒界-粒子相互作用の有限要素シミュレーションにおけるピン止め応力の解析
  • リュウカイ リュウシ ソウゴ サヨウ ノ ユウゲン ヨウソ シミュレーション ニ オケル ピンドメ オウリョク ノ カイセキ

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Abstract

The driving force for grain boundary migration and the pinning stress due to a particle are evaluated by three models (the Zener model, the modified Zener model and the sweep model), during the interaction between a curved grain boundary and a spherical particle simulated by the axi-symmetric finite element method. While the pinning stress is determined only by the contacting angle of grain boundary to particle surface in the Zener model, the effect of the change in boundary shape during Zener pinning is considered in the other two models. The variation of the pinning stress and the contacting angle at the maximum pinning stress evaluated by the three models show some differences, and are dependent on the particle size. The maximum pinning stress is linearly dependent on the particle size. When the grain boundary escapes from the particle, the driving force of the Zener model becomes zero because the particle becomes free from the grain boundary. However, in the sweep model, the driving force increases because of the locally increased curvature around the particle prior to escape, which is consistent with the simulation. The evaluation of the macroscopic movement of the grain boundary during Zener pinning is also carried out. The evaluated migration behavior by the sweep model when the grain boundary returns to the steady state agrees well with the simulation. It is found that the Zener model overestimates the pinning stress.

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