The New Etchability Evaluation Method of Electrodeposited Copper Foils for High-frequency Printed Wiring Board Materials

• SAIDA Muneo

  Electronics Materials Sector, Mitsui Mining & Smelting Co., Ltd.

• KODAMA Yukio

  Electronics Materials Sector, Mitsui Mining & Smelting Co., Ltd.

Bibliographic Information

Other Title

• 高周波対応プリント配線板材料用電解銅箔のエッチング特性の新しい評価方法

Journal

• 回路実装学会誌

  回路実装学会誌 10 (4), 258-260, 1995-07-20

Details

• CRID: 1570291224136416896
• NII Article ID: 10002644461
• NII Book ID: AN10564349
• ISSN: 13410571
• Text Lang: ja
• Data Source:
  • CiNii Articles