Electrochemical property of Al-Si alloy brazing filler.

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  • KURODA Shuu
    Technical Development Center, Mitsubishi Aluminum Co., Ltd.
  • ITAGAKI Takeshi
    Technical Development Center, Mitsubishi Aluminum Co., Ltd.
  • TOHMA Ken
    Technical Development Center, Mitsubishi Aluminum Co., Ltd.

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  • Ａｌ‐Ｓｉ合金ろう材の電気化学的性質
  • Al-Si合金ろう材の電気化学的性質
  • Al Si ゴウキン ロウザイ ノ デンキ カガクテキ セイシツ

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Abstract

To investigate localized corrosion characteristics of Al–Si alloy brazing filler, electrochemical measurements as well as immersion corrosion tests were carried out. Selective dissolution of eutectic phase occurred in the filler after brazing. On the other hand, no selective dissolution occurred in the filler with solution heat treatment after brazing. Pitting potential increased with increasing Si content in solid solution. Though cathodic reaction rate increased with an increase in Si content of the filler, the effect of Si itself was rather small. It was concluded that the localized corrosion of filler is caused by smaller Si content in solid solution at eutectic than that at primary α phase, and that matrix/Si particle interface acts as a more active cathode than matrix and Si particle.

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