Analysis of disappearance and migration at the bond interface during liquid phase diffusion bonding

• ENDO Kyosuke

  Department of Materials Science and engineering, Muroran Institute of Tecnology

• 田湯 善章

  Department of Materials Science and engineering, Muroran Institute of Tecnology

• 桃野 正

  Department of Materials Science and engineering, Muroran Institute of Tecnology

• 片山 博

  Department of Materials Science and engineering, Muroran Institute of Tecnology

Bibliographic Information

Other Title

• 液相拡散接合における接合界面の消失・移動現象の解析

Journal

• 材料とプロセス : 日本鉄鋼協会講演論文集 = Current advances in materials and processes : report of the ISIJ meeting

  材料とプロセス : 日本鉄鋼協会講演論文集 = Current advances in materials and processes : report of the ISIJ meeting 10 (3), A32-, 1997-03-27

Details

• CRID: 1570572699160864256
• NII Article ID: 10003797926
• NII Book ID: AN10056461
• ISSN: 09146628
• Text Lang: ja
• Data Source:
  • CiNii Articles