FORCED CONVECTIVE HEAT TRANSFER FROM A CHANNEL BETWEEN VERTICAL ELECTRONIC CIRCUIT BOARDS

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抄録

Forced convection is sometimes employed in the cooling of electronic equipment operating at high heat dissipation rates. The heated electronic components are usually arranged evenly on the vertical circuit boards.<BR>To analyze the heat transfer of such electronic equipment, the forced convective heat transfer between two vertical parallel electronic circuit boards (ECBs) was investigated. The local heat transfer coefficient from the board was affected by the Reynolds number, the distance between the boards, and the distance from the channel entrance.<BR>Two empirical equations for calculating local Nusselt numbers for the heat transfer in a channel between vertical electronic boards were obtained. One was for an ECB surface with components, another was for its rear surface without components, and the range of Reynolds numbers was from 1500 to 9000.

収録刊行物

  • Journal of chemical engineering of Japan

    Journal of chemical engineering of Japan 29(6), 960-966, 1996-12-01

    The Society of Chemical Engineers, Japan

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各種コード

  • NII論文ID(NAID)
    10003815709
  • NII書誌ID(NCID)
    AA00709658
  • 本文言語コード
    ENG
  • 資料種別
    ART
  • ISSN
    00219592
  • NDL 記事登録ID
    4109683
  • NDL 雑誌分類
    ZP1(科学技術--化学・化学工業)
  • NDL 請求記号
    Z53-R395
  • データ提供元
    CJP書誌  NDL  J-STAGE 
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