き裂面接触を考慮したＬＳＩパッケージの界面き裂の境界要素熱伝導・熱弾性解析

DOI Web Site Web Site 被引用文献4件

書誌事項

タイトル別名
  • Boundary Element Heat Conduction and Thermoelastic Analyses of Interface Crack in LSI Package in Consideration of Contact Between Crack Surfaces.
  • キレツメン セッショク オ コウリョシタ LSI パッケージ ノ カイメン キ

この論文をさがす

抄録

The interface crack initiated between the die pad (lead frame) and the resin encapsulant in the LSI package sometimes leads to package cracking and becomes critical to package fracture design. On the other hand, the property of thermal diffusion has become a main concern for recent package design of power semiconductor devices. To simulate these problems, we developed the boundary element heat conduction and thermoelastic analysis code, which can deal with thermoelastic contact of the interface crack. The stress intensity factors for an interface crack are calculated by the extrapolation method which is proposed by one of the authors. Using the above technique, the interface crack initiated in a plastic-molded LSI package is analyzed under conditions of uniform temperature loading and heat generation in the Si-chip. Calculated interfacial stress intensity factor Ki shows a decreasing trend against the interface crack length in all the above cases. Taking into account the contact of the crack surface, the results of the disturbance in temperature distribution are outstanding. However, the normalized stress intensity factor Ki/|ΔTmax| Shows almost identical behavior against with the crack length and is less dependent on the contact region length and the amount of heat generation.

収録刊行物

被引用文献 (4)*注記

もっと見る

キーワード

詳細情報 詳細情報について

問題の指摘

ページトップへ