Holographic Pattern Measuring System and its Application to Thermal Deformation Analysis of Printed Circuit Board
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- Taniguchi Masanari
- Meijo University
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- Takagi Tasuku
- Tohoku University
Bibliographic Information
- Other Title
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- ホログラフィックパターン計測システムとそのプリント配線板の熱変形解析への応用
- ホログラフィック パターン ケイソク システム ト ソノ プリント ハイセンバ
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Abstract
A new measuring system (Holographic Pattern Measuring System, HPMS) has been developed to the thermal deformation analysis of printed circuit board (PCB) due to thermal stress. The HPMS combines both techniques of holography and graphic image processing. The tempaeature on the PCB surface was measured by using a thermographic video system, and the relationship between temperature and displacement of the PCB was studied. As a result, the microscopical displacement of the displacement can be quantitatively measured, and the distribution of the displacement can be displayed as a three dimensional graphic image. The temperature distribution of the PCB surface showed the various relationship between the characteristics of the deformation. Therefore, the holographic pattern testing method may be useful in analysis of the detail thermal stress evaluation of the PCB.
Journal
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- IEEJ Transactions on Electronics, Information and Systems
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IEEJ Transactions on Electronics, Information and Systems 110 (9), 534-539, 1990
The Institute of Electrical Engineers of Japan
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Keywords
Details 詳細情報について
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- CRID
- 1390001204607456896
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- NII Article ID
- 130006843447
- 10003991087
- 40002524560
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- NII Book ID
- AN10065950
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- ISSN
- 13488155
- 03854221
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- NDL BIB ID
- 3678592
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed