黒鉛とニッケルの固相接合

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書誌事項

タイトル別名
  • Solid State Bonding of Graphite to Nickel
  • コクエン ト ニッケル ノ コソウ セツゴウ

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Graphite was bonded to Ni under a compressive stress range from 3 to 33 MPa in a vacuum over a temperature range from 973 to 1273 K using a RF-induction furnace. The influence of joining conditions on the bending strength of the graphite/Ni joint, and changes of microstructure and hardness near the joining interface of Ni, were investigated. Thermal stress induced in the joint was estimated with a finite element method. On the basis of these results the influence of thermal stress on the bending strength of the joint as examined.<BR>Completion of the graphite/Ni joint depends on both the compressive stress and the joining temperature. Good solid state bonding becomes feasible under low compressive stress in case of higher joining temperatures. Axisymmetric thermoelastic finite element analysis suggests that maximum tensile thermal stress is induced at a distance of 0.64 mm from the joining interface on the surface of the graphite and is increased with increasing joining temperatures. The position of fracture in a bending test corresponds approximately to that of the maximum tensile thermal stress. A part of the thermal stress in practical joints is relaxed and less than that calculated by finite element method. The bending strength of the joint increases with decreasing residual tensile stress on the surface of graphite. Relaxation of maximum tensile thermal stress depends on the amount of carbon atoms which diffuse into Ni. This may be related to the changes in plasticity of Ni and graphite, that is, the changes in the amounts of C super-saturately dissolved in Ni and the point defects introduces in graphite.

収録刊行物

  • 日本金属学会誌

    日本金属学会誌 64 (8), 597-603, 2000

    公益社団法人 日本金属学会

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