Cu-2.0 mass%Fe 合金の再結晶に及ぼす元素(Sb, Sn, Ti, P, Be)微量添加の効果

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タイトル別名
  • Influence of Small Amounts of Alloying Elements (Sb, Sn, Ti, P, Be)on Recrystallization Behavior of a Cu-2.0 mass%Fe Alloy
  • Cu 2 0 massパーセントFe ゴウキン ノ サイケッショウ ニ オヨボス ゲンソ Sb Sn Ti P Be ビリョウ テンカ ノ コウカ

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The effects of alloying elements (Sb, Sn, Ti, P and Be) in the range of addition up to 0.1 mass% on the recrystallization behavior of a Cu-2.0 mass%Fe alloy have been investigated by means of micro-hardness measurement and metallographic observation. The incubation time for recrystallization and the grain growth rate during recrystallization depend strongly on the content of each element. The grain formation and growth are accelerated by the addition of P and are suppressed by the addition of Sb, Sn, Ti and Be. A 0.05 mass%Be-added alloy recrystallizes least easily. Most recrystallization nuclei in Ti- and P-added alloys form at Fe2Ti and Fe3P particles larger than about 1.0 μm. For the alloys with Sb, Sn and Be, the nucleation of recrystallization takes place predominantly at α-Fe particles, larger than 0.3 μm, on grain boundaries. A good correlation is found between the time for recrystallization and the size of the Fe2Ti particles, Fe3P particles and α-Fe boundary particles. The larger the particle size, the more easily the nucleation of recrystallization occurs. Adding the solute elements affects the dispersion of α-Fe in-grain particles which retards grain-boundary migration and thus may control the grain growth.

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