エレクトロニクス分野への硫酸銅めっき技術  [in Japanese] Acid Copper Plating Technology for Electronics (Electro Device) Field  [in Japanese]

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Author(s)

Journal

  • Journal of The Surface Finishing Society of Japan

    Journal of The Surface Finishing Society of Japan 52(1), 50-51, 2001-01-01

    The Surface Finishing Society of Japan

References:  3

  • <no title>

    榎本英彦

    第123, 124回松下テクノリサーチセミナー要旨集, 1997

    Cited by (1)

  • <no title>

    YOKOI M.

    DENKI KAGAKU 51(6), 456, 1983

    Cited by (1)

  • <no title>

    横井昌幸

    金属表面技術 34, 434, 1983

    Cited by (2)

Cited by:  1

Codes

  • NII Article ID (NAID)
    10006251120
  • NII NACSIS-CAT ID (NCID)
    AN1005202X
  • Text Lang
    JPN
  • Article Type
    Journal Article
  • ISSN
    09151869
  • Data Source
    CJP  CJPref  J-STAGE 
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