書誌事項
- タイトル別名
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- The Development of Microchannel Chip Using Chemical Bonding Technique at Room Temperature
- カガクテキ シュホウ オ モチイタ マイクロチャンネルチップ テイオン セツゴウ ギジュツ
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Several bonding techniques for the development of microchannel chip at room temperature were studied. An electrostatic interaction between poly-ion layers with opposite charge and a condensation of silane coupling agent was employed to bond two glass substrates. In former case, the bonding of the substrates was achieved by applying high electrical potential. On the other hand, the condensation of silane coupling agent could bond the two glass substrates at room temperature and atmosphere. It was confirmed that the microchannel developed using the silane coupling agent could work for flow channel without solution leak. Poly(dimethylsiloxane)(PDMS) substrate was also applied for chip development. As a result, it was confirmed that PDMS was a material for easy and rapid fabrication of microchannel chip integrated with film electrodes
収録刊行物
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- 電気学会論文誌E(センサ・マイクロマシン部門誌)
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電気学会論文誌E(センサ・マイクロマシン部門誌) 122 (3), 172-178, 2002
一般社団法人 電気学会
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詳細情報 詳細情報について
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- CRID
- 1390282679438102144
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- NII論文ID
- 10007792552
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- NII書誌ID
- AN1052634X
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- ISSN
- 13475525
- 13418939
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- NDL書誌ID
- 6089298
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
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- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可