超小型積層セラミックチップ部品と積層モジュールの開発  [in Japanese] Development of Ultra-miniaturized Multilayer Ceramic Chip Components and Multilayer Module  [in Japanese]

Access this Article

Search this Article

Author(s)

Abstract

High-speed laser drilling using low laser power and flexible circuit layout were applied to the fabrication of 3-dimensional circuits in multilayer ceramics of miniaturized chip inductors and high-frequency power amplifier modules. The optimized combination of pulse YAG laser energy and the laser absorption coefficient of machined materials realized ultra-fine through-holes formed in thin ceramic green sheets without damaging plastic film where ceramic slurry was cast. Laser drilling based on thermal ablation.

Journal

  • Journal of the Japan Society of Powder and Powder Metallurgy

    Journal of the Japan Society of Powder and Powder Metallurgy 49(3), 203-210, 2002-03-15

    Japan Society of Powder and Powder Metallurgy

References:  11

Cited by:  1

Codes

  • NII Article ID (NAID)
    10008007590
  • NII NACSIS-CAT ID (NCID)
    AN00222724
  • Text Lang
    JPN
  • Article Type
    Journal Article
  • ISSN
    05328799
  • NDL Article ID
    6126538
  • NDL Source Classification
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL Call No.
    Z17-274
  • Data Source
    CJP  CJPref  NDL  J-STAGE 
Page Top