超小型積層セラミックチップ部品と積層モジュールの開発 [in Japanese] Development of Ultra-miniaturized Multilayer Ceramic Chip Components and Multilayer Module [in Japanese]
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High-speed laser drilling using low laser power and flexible circuit layout were applied to the fabrication of 3-dimensional circuits in multilayer ceramics of miniaturized chip inductors and high-frequency power amplifier modules. The optimized combination of pulse YAG laser energy and the laser absorption coefficient of machined materials realized ultra-fine through-holes formed in thin ceramic green sheets without damaging plastic film where ceramic slurry was cast. Laser drilling based on thermal ablation.
- Journal of the Japan Society of Powder and Powder Metallurgy
Journal of the Japan Society of Powder and Powder Metallurgy 49(3), 203-210, 2002-03-15
Japan Society of Powder and Powder Metallurgy