セラミック電子部品製造における回転焼成法の開発  [in Japanese] Rotary Firing Method for the Manufacturing of Ceramic Electronic Devices  [in Japanese]

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Author(s)

    • 沖中 秀行 OKINAKA Hideyuki
    • 松下電子部品(株)開発技術センター Matsushita Electronic Components Co., Ltd. Corporate Components Development Center

Abstract

Ceramic electronic components have generally been manufactured by the static firing of green bodies in a sagger. In this paper, we studied a dynamic rotary firing method in which the sagger is rotated during the firing process. It prevented shape defect such as bending and sticking between samples, and reduced the distribution of the electric characteristics. It was found that the optimized sample locations in a sagger and conditions of rotations prevented appearance defect and reduced the distribution of dimensions even when green bodies were put at random locations. It was proved that the introduction of the rotary firing process could improve the productivity and reduce the energy consumption and especially the manufacturing cost drastically when the manufacturing scale is appropriate for it.

Journal

  • Journal of the Japan Society of Powder and Powder Metallurgy

    Journal of the Japan Society of Powder and Powder Metallurgy 49(3), 223-227, 2002-03-15

    Japan Society of Powder and Powder Metallurgy

References:  3

Codes

  • NII Article ID (NAID)
    10008007634
  • NII NACSIS-CAT ID (NCID)
    AN00222724
  • Text Lang
    JPN
  • Article Type
    REV
  • ISSN
    05328799
  • NDL Article ID
    6126579
  • NDL Source Classification
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL Call No.
    Z17-274
  • Data Source
    CJP  NDL  J-STAGE 
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