インナーバンプ用はんだ複合銅コアマイクロボール [in Japanese] Solder Composite Copper Cored Micro-ball for lnner-bump [in Japanese]
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Micro-ball bump technology has been developed for high density flip chip (FC) interconnection of high Performance LSI chips. Thick solder plated balls with copper core of 40-100μm diameter were prepared and tested. This micro-ball is valuable for inner-bump of high density stacked package.
- Journal of the Japan Society of Powder and Powder Metallurgy
Journal of the Japan Society of Powder and Powder Metallurgy 49(3), 237-241, 2002-03-15
Japan Society of Powder and Powder Metallurgy