インナーバンプ用はんだ複合銅コアマイクロボール  [in Japanese] Solder Composite Copper Cored Micro-ball for lnner-bump  [in Japanese]

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Author(s)

Abstract

Micro-ball bump technology has been developed for high density flip chip (FC) interconnection of high Performance LSI chips. Thick solder plated balls with copper core of 40-100μm diameter were prepared and tested. This micro-ball is valuable for inner-bump of high density stacked package.

Journal

  • Journal of the Japan Society of Powder and Powder Metallurgy

    Journal of the Japan Society of Powder and Powder Metallurgy 49(3), 237-241, 2002-03-15

    Japan Society of Powder and Powder Metallurgy

References:  7

Codes

  • NII Article ID (NAID)
    10008007644
  • NII NACSIS-CAT ID (NCID)
    AN00222724
  • Text Lang
    JPN
  • Article Type
    SHO
  • ISSN
    05328799
  • NDL Article ID
    6126607
  • NDL Source Classification
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL Call No.
    Z17-274
  • Data Source
    CJP  NDL  J-STAGE 
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