ハルセル試験による銅電解添加剤の制御指針の検討  [in Japanese] Control of Additives in Copper Electrorefining by Using the Hull Cell Test  [in Japanese]

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Author(s)

Abstract

To produce high-quality electrolytic copper, the influence of additives on copper electrodeposition was studied, and the design and control of the additives in copper electrorefining were discussed in the present paper. The experiment for the influence of the additives such as glue, thiourea and chloride ion in the copper electrolyte on the surface roughness in electrodeposition were carried out with the Hull Cell test and the practical scale test, and the additives strength was defined by the concentrations of these additives, which was clarified to be useful for controlling the copper electrolyte. An expression as a function of the copper concentration in the electrolyte, the additives strength, the current density and the electrode space was also derived for obtaining the smooth electrodeposition, which is of great help in controlling the copper electrolysis.

Journal

  • Shigen-to-Sozai

    Shigen-to-Sozai 118(2), 86-90, 2002-02-25

    The Mining and Materials Processing Institute of Japan

References:  5

Codes

  • NII Article ID (NAID)
    10008012273
  • NII NACSIS-CAT ID (NCID)
    AN10062646
  • Text Lang
    JPN
  • Article Type
    ART
  • ISSN
    09161740
  • NDL Article ID
    6083570
  • NDL Source Classification
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL Call No.
    Z17-315
  • Data Source
    CJP  NDL  J-STAGE 
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