無電解めっき処理エポキシ樹脂のガス放出特性 Outgassing Characteristics of Electroless Plated Epoxy Resin
Outgassing rate of an epoxy resin is the most important property in application of an epoxy resin for semiconductor processing in a high vacuum environment. Main desorbed gases is H<SUB>2</SUB>O from the surface and the inside of the epoxy resin.<BR>Electroless plating process was improved by Cu and Ni plating and the impregnation of the epoxy resin on pre-etching process. Outgassing rate of the epoxy resin plated Cu and Ni layer was two orders of magnitude smaller than that of nonplated epoxy resin.
真空 45(3), 142-144, 2002-03-20
The Vacuum Society of Japan