書誌事項
- タイトル別名
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- Outgassing Characteristics of Electroless Plated Epoxy Resin.
- ムデンカイメッキ ショリ エポキシ ジュシ ノ ガス ホウシュツ トクセイ
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Outgassing rate of an epoxy resin is the most important property in application of an epoxy resin for semiconductor processing in a high vacuum environment. Main desorbed gases is H2O from the surface and the inside of the epoxy resin.<BR>Electroless plating process was improved by Cu and Ni plating and the impregnation of the epoxy resin on pre-etching process. Outgassing rate of the epoxy resin plated Cu and Ni layer was two orders of magnitude smaller than that of nonplated epoxy resin.
収録刊行物
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- 真空
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真空 45 (3), 142-144, 2002
一般社団法人 日本真空学会
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詳細情報
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- CRID
- 1390001204064731648
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- NII論文ID
- 10008202824
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- NII書誌ID
- AN00119871
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- ISSN
- 18809413
- 05598516
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- NDL書誌ID
- 6144125
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可