無電解めっき処理エポキシ樹脂のガス放出特性  [in Japanese] Outgassing Characteristics of Electroless Plated Epoxy Resin  [in Japanese]

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Author(s)

Abstract

Outgassing rate of an epoxy resin is the most important property in application of an epoxy resin for semiconductor processing in a high vacuum environment. Main desorbed gases is H<SUB>2</SUB>O from the surface and the inside of the epoxy resin.<BR>Electroless plating process was improved by Cu and Ni plating and the impregnation of the epoxy resin on pre-etching process. Outgassing rate of the epoxy resin plated Cu and Ni layer was two orders of magnitude smaller than that of nonplated epoxy resin.

Journal

  • Shinku

    Shinku 45(3), 142-144, 2002-03-20

    The Vacuum Society of Japan

References:  1

  • <no title>

    濱尾

    第41回真空に関する連合講演会講演予稿集, 2000

    Cited by (1)

Codes

  • NII Article ID (NAID)
    10008202824
  • NII NACSIS-CAT ID (NCID)
    AN00119871
  • Text Lang
    JPN
  • Article Type
    SHO
  • ISSN
    05598516
  • NDL Article ID
    6144125
  • NDL Source Classification
    ZN15(科学技術--機械工学・工業--流体機械)
  • NDL Call No.
    Z16-474
  • Data Source
    CJP  NDL  J-STAGE 
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