Micro Connector for High Packaging Density Fabricated by Using UV Thick Photoresist

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Author(s)

Journal

  • The Transactions of the Institute of Electrical Engineers ofJapan. E, A Publication of Sensors and Micromachines Associated Society

    The Transactions of the Institute of Electrical Engineers ofJapan. E, A Publication of Sensors and Micromachines Associated Society 122(5), 249-255, 2002-05-01

    電気学会

References:  8

Cited by:  2

Codes

  • NII Article ID (NAID)
    10008218895
  • NII NACSIS-CAT ID (NCID)
    AN1052634X
  • Text Lang
    ENG
  • Article Type
    Journal Article
  • ISSN
    13418939
  • NDL Article ID
    6152603
  • NDL Source Classification
    ZN31(科学技術--電気工学・電気機械工業)
  • NDL Call No.
    Z16-B380
  • Data Source
    CJP  CJPref  NDL 
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