ガラス基板上への無電解NiPめっきの初期析出挙動  [in Japanese] Initial Deposition Behavior of Electroless Nickel on Glass Substrate  [in Japanese]

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Author(s)

Abstract

Initial deposition rate and appearance of deposited nickel on glass are measured to realize the role of a complexing agent in the electroless plating bath.<br>We evaluated carboxylic acids, hydro carboxylic acids and amino acids as complexing agent.<br>Among these complexing agents, carboxylic acids and hydro carboxylic acids indicated an acceleration effect and amino acids showed a retardation effect on the plating rate.<br>Deposited nickel particles are agglomerated ranging from 10 to 30nm in the early deposition stages.<br>Glycine among the complexing agents showed the smallest particle sizes in the initial deposition stages and nickel was uniformly deposited and distributed on glass.<br>Therefore, this may lead the improvement of the adhesion strength of deposited nickel on glass.

Journal

  • Journal of The Surface Finishing Society of Japan

    Journal of The Surface Finishing Society of Japan 53(4), 256-261, 2002-04-01

    The Surface Finishing Society of Japan

References:  17

  • <no title>

    田代雄彦

    表面技術 47, 349, 1996

    Cited by (7)

  • <no title>

    田代雄彦

    表面技術 50, 140, 1999

    Cited by (5)

  • <no title>

    初川拓朗

    表面技術 45, 543, 1994

    Cited by (4)

  • <no title>

    田代雄彦

    表面技術 52, 289, 2001

    Cited by (4)

  • <no title>

    高田祐一

    表面技術協会第103回講演大会講演要旨集 31, 2001

    Cited by (1)

  • <no title>

    HSU Hong-Hui

    J. The Electrochem Soc. 148, C47, 2001

    Cited by (1)

  • <no title>

    稲葉裕之

    表面技術 52, 222, 2001

    Cited by (3)

  • <no title>

    堀田慎一

    表面技術 44, 831, 1993

    Cited by (3)

  • <no title>

    有泉直子

    表面技術 51, 1011, 2000

    Cited by (4)

  • <no title>

    本間敬之

    表面技術 50, 395, 1999

    Cited by (3)

  • <no title>

    小林靖之

    表面技術協会第101回講演大会講演要旨集 247, 2000

    Cited by (1)

  • <no title>

    大木道則

    化学辞典 509, 1994

    Cited by (1)

  • <no title>

    MALLORY G. O.

    Plating 61, 1005, 1974

    Cited by (6)

  • <no title>

    大野湶

    金属表面技術 34, 594, 1983

    Cited by (3)

  • <no title>

    山田祥一郎

    配位化学-金属錯体の化学 160, 1977

    Cited by (1)

  • <no title>

    横島時彦

    表面技術 49, 1336, 1998

    Cited by (2)

  • <no title>

    電気めっき研究会編

    無電解めっき基礎と応用 17, 2001

    Cited by (2)

Codes

  • NII Article ID (NAID)
    10008222337
  • NII NACSIS-CAT ID (NCID)
    AN1005202X
  • Text Lang
    JPN
  • Article Type
    ART
  • ISSN
    09151869
  • NDL Article ID
    6144033
  • NDL Source Classification
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL Call No.
    Z17-291
  • Data Source
    CJP  NDL  J-STAGE 
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