置換型析出による無電解Sn-Ag合金めっき Electroless Sn-Ag Alloy Plating by Displacement Reaction

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Abstract

<p>Electroless Sn-Ag alloy plating by the displacement reaction was investigated. A new bath containing potassium pyrophosphate, potassium iodide, metal salts, and thiourea was used. First, examinations of electroless Sn plating and electroless Ag plating were carried out, and then electroless Sn-Ag alloy plating was investigated. Anodic and cathodic polarizations were conducted to clarify the deposition mechanism. Sn-Ag alloy films with a range of Ag concentrations from 24 to 52 at.% were obtained. The surface morphology of the films became smoother with decreasing Ag content. The Sn-Ag alloy films consisted of the <i>β</i>-Sn phase and the <i>ε </i>(Ag<sub>3</sub>Sn) phase.</p>

Journal

  • Electrochemistry

    Electrochemistry 70(5), 311-315, 2002-05-05

    The Electrochemical Society of Japan

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Codes

  • NII Article ID (NAID)
    10008223504
  • NII NACSIS-CAT ID (NCID)
    AN00151637
  • Text Lang
    ENG
  • Article Type
    ART
  • ISSN
    13443542
  • NDL Article ID
    6128400
  • NDL Source Classification
    ZP1(科学技術--化学・化学工業)
  • NDL Call No.
    Z17-14
  • Data Source
    CJP  NDL  J-STAGE 
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