誘電体及び半導体のDUV/VUVレーザー加工とフェムト秒レーザー加工の比較  [in Japanese] Comparison between DUV/VUV and Femtosecond Laser Processing of Dielectrics and Semiconductors  [in Japanese]

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Author(s)

Abstract

Both of DUV/VUV and femtosecond lasers are expected as novel tools for materials processing for the next generation. DUV/VUV laser is good at surface micropatterning and surface shaping, while femtosecond laser is suitable for internal modification of transparent materials as well as micro-hole drilling, cutting and high aspect ratio machining. In this paper, precison microfabrication of dielectrics and semiconductors using DUV/VUV and femtosecond lasers are reviewed, and features of each laser processing are compared.

Journal

  • The Review of Laser Engineering

    The Review of Laser Engineering 30(5), 226-232, 2002-05-15

    The Laser Society of Japan

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Codes

  • NII Article ID (NAID)
    10008508763
  • NII NACSIS-CAT ID (NCID)
    AN00255326
  • Text Lang
    JPN
  • Article Type
    Journal Article
  • ISSN
    03870200
  • NDL Article ID
    6168098
  • NDL Source Classification
    ZN33(科学技術--電気工学・電気機械工業--電子工学・電気通信)
  • NDL Call No.
    Z16-1040
  • Data Source
    CJP  CJPref  NDL  J-STAGE 
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