Comparison between DUV/VUV and Femtosecond Laser Processing of Dielectrics and Semiconductors.
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- SUGIOKA Koji
- RIKEN — The Institute of Physical and Chemical Research
Bibliographic Information
- Other Title
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- 誘電体及び半導体のDUV/VUVレーザー加工とフェムト秒レーザー加工の比較
- レーザー解説 誘電体及び半導体のDUV/VUVレーザー加工とフュムト秒レーザー加工の比較
- レーザー カイセツ ユウデンタイ オヨビ ハンドウタイ ノ DUV VUV レーザー カコウ ト フュムトビョウ レーザー カコウ ノ ヒカク
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Abstract
Both of DUV/VUV and femtosecond lasers are expected as novel tools for materials processing for the next generation. DUV/VUV laser is good at surface micropatterning and surface shaping, while femtosecond laser is suitable for internal modification of transparent materials as well as micro-hole drilling, cutting and high aspect ratio machining. In this paper, precison microfabrication of dielectrics and semiconductors using DUV/VUV and femtosecond lasers are reviewed, and features of each laser processing are compared.
Journal
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- The Review of Laser Engineering
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The Review of Laser Engineering 30 (5), 226-232, 2002
The Laser Society of Japan
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Keywords
Details
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- CRID
- 1390282679622264960
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- NII Article ID
- 10008508763
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- NII Book ID
- AN00255326
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- COI
- 1:CAS:528:DC%2BD38XlvVGqsLg%3D
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- ISSN
- 13496603
- 03870200
- http://id.crossref.org/issn/03870200
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- NDL BIB ID
- 6168098
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed