LSI銅配線とウェットプロセス  [in Japanese] Wet Processes for Making Cu Interconnection in LSI  [in Japanese]

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Author(s)

Journal

  • Journal of The Surface Finishing Society of Japan

    Journal of The Surface Finishing Society of Japan 53(6), 380-385, 2002-06-01

    The Surface Finishing Society of Japan

References:  7

  • <no title>

    EDELSTEIN D.

    IEDM Tech. Digest 773, 1997

    Cited by (1)

  • <no title>

    WACHNIK R. A.

    Advanced Metallization Conference 2000 447, 2000

    Cited by (1)

  • <no title>

    CHEN L.

    Electrochem. Soc. Proc. 275, 2-6, 1999

    Cited by (1)

  • <no title>

    REID J.

    Advanced Metallization Conference 1999 53, 1999

    Cited by (1)

  • <no title>

    Chris Yu

    Advanced Metallization Conference 1998 97, 1998

    Cited by (1)

  • <no title>

    OHASHI N.

    International Interconnect Technology Conference 2001 140, 2001

    Cited by (1)

  • Copper self-sputtering by planar magnetron

    ASAMAKI T.

    Jpn. J. Appl. Phys. 33, 2500-2503, 1994

    DOI  Cited by (5)

Codes

  • NII Article ID (NAID)
    10008556762
  • NII NACSIS-CAT ID (NCID)
    AN1005202X
  • Text Lang
    JPN
  • Article Type
    REV
  • ISSN
    09151869
  • NDL Article ID
    6185198
  • NDL Source Classification
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL Call No.
    Z17-291
  • Data Source
    CJP  NDL  J-STAGE 
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