EBSPによる拡散対界面の解析  [in Japanese] Structural Analysis of Diffusion-Couple Interface Using EBSP  [in Japanese]

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Author(s)

    • 堀田 善治 HORITA Zenji
    • 九州大学大学院工学研究院材料工学部門 Department of Materials Science and Engineering, Graduate School of Engineering, Kyushu University

Journal

  • Materia Japan

    Materia Japan 40(7), 634-637, 2001-07-20

    The Japan Institute of Metals and Materials

References:  6

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    WATANABE M.

    Defect and Diffusion Forum 143-147, 637, 1997

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    WATANABE M.

    Inter. Sci. 4, 229, 1997

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    Janssen M. M. P.

    Metall. Trans. 4, 1623, 1973

    Cited by (3)

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    FUJIWARA K.

    Proc. 3rd Pacific Inter. Conf. on Advanced Materials and Processings (PRICM3) 1251, 1998

    Cited by (1)

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    WATANABE M.

    Acta Metall. Mater. 42, 3389, 1994

    Cited by (4)

  • <no title>

    OOTOSHI Y.

    Interface Science and Materials Interconnection, (Proc. of JIMIS-8) 427, 1996

    Cited by (1)

Codes

  • NII Article ID (NAID)
    10008846462
  • NII NACSIS-CAT ID (NCID)
    AN10433227
  • Text Lang
    JPN
  • Article Type
    REV
  • ISSN
    13402625
  • NDL Article ID
    5852919
  • NDL Source Classification
    ZP41(科学技術--金属工学・鉱山工学)
  • NDL Call No.
    Z17-313
  • Data Source
    CJP  NDL  J-STAGE 
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