断面 TEM 解析の液晶ディスプレイ実装技術への応用  [in Japanese] Cross-sectional TEM Analysis of Packaging Technology for LCD  [in Japanese]

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Author(s)

Journal

  • Materia Japan

    Materia Japan 40(12), 997, 2001-12-20

    The Japan Institute of Metals and Materials

References:  1

  • <no title>

    OVERWIJK M. H. F.

    J. Vac. Sci. Thechnol., B 11, 2021, 1993

    DOI  Cited by (16)

Codes

  • NII Article ID (NAID)
    10008847775
  • NII NACSIS-CAT ID (NCID)
    AN10433227
  • Text Lang
    JPN
  • Article Type
    REV
  • ISSN
    13402625
  • Data Source
    CJP  J-STAGE 
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