環境調和型実装技術 : 鉛フリーはんだ付け  [in Japanese] Environmentally conscious Electronics packaging technology : Lead-free soldering  [in Japanese]

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Author(s)

Journal

  • 應用物理

    應用物理 70(7), 857-858, 2001-07-10

References:  7

  • <no title>

    菅沼克昭

    まてりあ 38, 927, 1999

    Cited by (1)

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    SUGANUMA K.

    J. Mater. Res. 15, 884, 2000

    Cited by (1)

  • <no title>

    KARIYA Y.

    J. Electron. Mater. 28, 1263, 1999

    Cited by (1)

  • <no title>

    KARIYA Y.

    Soldering & Surf. Mount Technol. 13, 39, 2000

    Cited by (1)

  • <no title>

    HOMER C. E.

    Metal. Ind. 364, 1942

    Cited by (1)

  • <no title>

    菅沼克昭

    鉛フリーはんだ付け技術, 2001

    Cited by (2)

  • <no title>

    SUGANUMA K.

    Current Opinion Solid State & Mater. Sci. 5, 555, 2001

    Cited by (1)

Codes

  • NII Article ID (NAID)
    10008981664
  • NII NACSIS-CAT ID (NCID)
    AN00026679
  • Text Lang
    JPN
  • Article Type
    NOT
  • ISSN
    03698009
  • Data Source
    CJP 
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