A New Slicing Method of Monocrystalline Silicon Ingot by Wire EDM

• OKADA Akira

  Department of Mechanical Engineering, Okayama University,

• UNO Yoshiyuki

  Department of Mechanical Engineering, Okayama University,

• OKAMOTO Yasuhiro

  Department of Mechanical Engineering, Okayama University,

• ITOH Hisashi

  Department of Mechanical Engineering, Okayama University,

• HIRANO Tameyoshi

  Toyo Advanced Technologies Co., Ltd

収録刊行物

• International journal of electrical machining

  International journal of electrical machining 8 21-26, 2003-01-01

キーワード

• Silicon wafer
• Monocrystalline silicon ingot
• Slicing
• Wire EDM
• Contamination

詳細情報

• CRID: 1571417124916268416
• NII論文ID: 10011443919
• NII書誌ID: AN10564586
• ISSN: 13417908
• 本文言語コード: en
• データソース種別:
  • CiNii Articles